The Pulse
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GUC Monthly Sales Report – November 2025
2025-12-05T08:02:00+00:00
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Global Semiconductor Sales Increase 4.7% Month-to-Month in October
2025-12-05T07:51:16+00:00
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CXL Adds Port Bundling to Quench AI Thirst
2025-12-05T07:38:05+00:00
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Tenstorrent and AutoCore Announce Strategic Partnership to Power High-Performance RISC-V Automotive Computing with AutoCore.OS
2025-12-05T07:32:31+00:00
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Tenstorrent Announces Availability of TT-Ascalon™
2025-12-05T07:27:00+00:00
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DCD-SEMI Unveils Ultra-Fast DAES IP Core for AES Encryption
2025-12-04T15:26:00+00:00
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MosChip Collaborates with EMASS on Silicon Implementation for its Breakthrough Edge AI SoC
2025-12-04T14:59:11+00:00
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The importance of ADCs in low-power electrocardiography ASICs
2025-12-04T14:38:00+00:00
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Innatera and 42T join forces to power the next wave of intelligent product innovation
2025-12-04T14:06:01+00:00
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VESA Adaptive-Sync V2 Operation in DisplayPort VIP
2025-12-04T11:17:52+00:00
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UMC and Polar Collaborate to Meet Growing Demand for U.S. Onshore Semiconductor Manufacturing
2025-12-04T09:13:00+00:00
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Certus Semiconductor adopts AI-powered Solido to accelerate IO library, analog IP and ESD development
2025-12-04T08:19:41+00:00
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UMC Reports Sales for November 2025
2025-12-04T08:14:51+00:00
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How Europe Navigates Geopolitics in Pursuit of Semiconductor Sovereignty
2025-12-04T07:05:32+00:00
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Quintauris and Vector collaborate to integrate MICROSAR Classic on Quintauris’ RT-EUROPA real-time automotive platform
2025-12-04T06:54:02+00:00
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ASIC Shift for High-Speed Computing: PGC’s Design Service Turnkey Platform Speeds Time-to-Market
2025-12-04T06:42:42+00:00
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Attopsemi I-fuse® OTP was successfully adopted by Wiliot for IoT Pixels
2025-12-03T08:00:00+00:00
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Design, Verification, and Software Development Decisions Require a Single Source of Truth
2025-12-03T07:36:02+00:00
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RoMe: Row Granularity Access Memory System for Large Language Models
2025-12-03T07:20:18+00:00
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Arteris Selected by Black Sesame Technologies for Next Generation of Intelligent Driving Silicon
2025-12-02T14:06:00+00:00
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Semidynamics Welcomes Iakovos Stamoulis as Chief Technology Officer
2025-12-02T13:23:00+00:00
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Idaho Scientific Selects QuickLogic eFPGA Hard IP to Enable Crypto Agility
2025-12-02T12:23:00+00:00
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Analog Foundation Models
2025-12-02T07:17:05+00:00
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GlobalFoundries Appoints Matthew Zack as Chief Corporate Development Officer
2025-12-02T05:02:08+00:00
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VeriSilicon’s NPU IP VIP9000NanoOi-FS has achieved ISO 26262 ASIL B certification
2025-12-02T04:55:00+00:00
The Semiconductor IP Marketplace that puts you first
Semi IP Hub's mission is to provide you with a platform where you can find Silicon IP cores for your next project without being harassed by dozens of sellers.
Here, your contact details are not shared with third parties unless you request to be contacted by a supplier.
Spotlight
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UCIe PHY (Die-to-Die) IP
- Compliant with UCIe v2.0, supporting 4/8/12/16/24/32GT/s data rates
- for Standard Package up to 16 lanes / for Advanced Package up to 64 lanes
- Provides a 1024-bit data bus width with high-throughput die-to-die communication
- Includes automatic per-lane calibration and optional transmitter de-emphasis
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Simulation VIP for LPDDR6
- This Verification IP (VIP) is intended for modeling the upcoming JEDEC Low-Power Memory Device, LPDDR6 design specification.
- It provides a mature, highly capable compliance verification solution that supports simulation, formal analysis, and hardware acceleration platforms, making it applicable to intellectual property (IP), system-on-chip (SoC), and system-level verification.
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UCIe-S 64GT/s PHY IP
- The UCIe-S 64GT/s PHY IP is a cutting-edge solution designed to meet the growing demand for ultra-high-speed interconnects between dies in standard packaging environments.
- Leveraging the UCIe (Universal Chiplet Interconnect Express) 3.0 standard, this IP supports a blistering data rate of up to 64Gbps per lane, enabling next-generation AI, HPC, and data center SoC applications.
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UA Link DL IP core
- The UA Link DL IP Core is a high-performance, silicon-agnostic and fully compliant Data Layer implementation of UALink_200 specifi cation.
- Designed for seamless integration into accelerator, switch, and SoC designs, it delivers deterministic low-latency, robust error correction, and compatibility with multiple high-speed Ethernet-derived link rates.
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10-bit Pipeline ADC - Tower 180 nm
- 10-bit resolution
- 25 MSPS sampling rate
- 6 mW power
- 25 MHz Input Bandwidth
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NoC Verification IP
- Complex network with acyclic agent graph (DAG). Layered and parallel NOC is also supported.
- Any number of master and slave ports is supported. Each port can be configured individually.
- ARM® AHB3-Lite,5, ARM® AXI 3,4,4-Lite,5,5-Lite, ARM® APB 2,3,4,5, SiFive TileLink Tl-UL, Tl-UH, TL-C.
UCIe Controller IP View All
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UCIe Die-to-Die Chiplet Controller
- High configurability and customizability
- Defines packets to communicate with a link partner using different AXI parameters
- Supports raw streaming modes
- Provides various Flit formats in UCIe v1.1 (filt format 2: 68B flit format, flit format 3/4: standard 256B flit format, and flit format 5/6: latency optimized 256B flit format)
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UCIe PHY & D2D Adapter
- 32Gbps UCIe-Advanced (UCIe-A) & Standard (UCIe-S)
- UCIe v1.1 specification
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TSMC CLN5FF GUCIe LP Die-to-Die PHY
- IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face advanced package.
- This GUCIe PHY not only supports UCIe specification rev 1.1 compliance physical layer and Raw D2D interface (RDI) but also optionally provides the
PCIe 7.0 IP View All
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PCIe 7.0 Controller with AXI
- Optimized for high-bandwidth efficiency at data rates up to 128 GT/s
- Separate native TX/RX data path separating posted/Non posted/completion traffic
- Handles up to 4 TLPs per cycle
- Advanced PIPE modes and port bifurcation
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PCIe 7.0 PHY IP
- Physical Coding Sublayer (PCS) block with PIPE interface
- Supports PCIe 7.0, encoding, backchannel initialization
- Lane margining at the receiver
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PCIe 7.0 PHY in TSMC (N5, N3P)
- Physical Coding Sublayer (PCS) block with PIPE interface
- Supports PCIe 7.0, encoding, backchannel initialization
- Lane margining at the receiver
- Spread-spectrum clocking (SSC)
AI IP View All
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RISC-V CPU IP
- RISC-V RVA23 Compliant
- >18 SPECint2006/GHz
- 8-wide decode unit
- Advanced branch predictor
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NPU IP for Embedded ML
- Fully programmable to efficiently execute Neural Networks, feature extraction, signal processing, audio and control code
- Scalable performance by design to meet wide range of use cases with MAC configurations with up to 64 int8 (native 128 of 4x8) MACs per cycle
- Future proof architecture that supports the most advanced ML data types and operators
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Future-proof IP for training and inference with leading performance per watt and per dollar
- RISC-V-based AI IP development for enhanced training and inference.
- Silicon-proven solutions tailored for AI workload optimization.
- Energy-efficient performance with industry-leading Perf/W.
MIPI IP View All
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MIPI C-PHY/D-PHY Combo CSI-2 RX+ IP (6.0Gsps/trio, 4.5Gbps/lane) in TSMC N6
- Dual mode PHY Supports MIPI Alliance Specification D-PHY v2.5 & C-PHY v2.0
- Consists of 1 Clock lane and 4 Data lanes in D-PHY mode
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MIPI CSI-2 controller Receiver v 2.1, Compatible with MIPI C-PHY v1.2 & DPHY v2.1.
- Fully compliant to MIPI standard
- Small footprint
- Code validated with Spyglass
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MIPI D-PHY IP for TSMC (5nm, 6/7nm, 12/16nm, 22nm, 28nm, 40nm)
- Compliant to MIPI Alliance Standard for D-PHY specification Version 2.1, 1.2, 1.1
- Supports standard PHY transceiver compliant to MIPI Specification
- Supports standard PPI interface compliant to MIPI Specification
- Supports synchronous transfer at high speed mode with a bit rate of 80-2500 Mb/s
RISC-V IP View All
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32b/64b RISC-V 5-stage, scalar, in-order, Application Processor. Linux and multi-core capable. Maps upto ARM A-35. Optimal PPA.
- 32/64 Bit RISC-V core
- 5-stage pipeline
- In-order, Single issue
- Multicore Capable (up to 8 cores)
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Dual-issue Linux-capable RISC-V core
- 64-bit RISC-V core
- RVA22 profile
- Linux capable
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High-performance RISC-V CPU
- Fully compliant with the RVA23 RISC-V specification
- Comparable PPA to Arm Neoverse V3 / Cortex-X4
- Standard AMBA CHI.E coherent interface for SoC and chiplet integration
- Co-architected with Veyron E2 for seamless vector, AI acceleration, and big-little style heterogeneous compute configurations