The Pulse
-
IObundle Promotes IOb-Cache: Premier Open-Source Cache System for AI/ML Memory Bottlenecks
2026-02-24T17:50:00+00:00
-
Quintauris Secures Capital Increase to Accelerate RISC-V Adoption
2026-02-24T14:55:00+00:00
-
MIPI Alliance Releases UniPro v3.0 and M-PHY v6.0, Accelerating JEDEC UFS Performance for Edge AI in Mobile, PC and Automotive
2026-02-24T14:26:00+00:00
-
Marvell to Showcase PCIe 8.0 SerDes Demonstration at DesignCon 2026
2026-02-24T14:19:58+00:00
-
Embedded FPGA reaches a new stage of industrial maturity – Menta at Embedded World 2026
2026-02-24T12:45:24+00:00
-
Securing UALink: Introducing Synopsys UALinkSec_200 Security Module
2026-02-24T09:04:00+00:00
-
CQ-CiM: Hardware-Aware Embedding Shaping for Robust CiM-Based Retrieval
2026-02-24T08:42:00+00:00
-
Fraunhofer IPMS collaborates with Korean TSN Lab to further develop IP solutions for automotive and industrial connectivity
2026-02-24T07:05:00+00:00
-
Via Licensing Alliance Announces Longcheer and Desay SV as New Licensees to its Qi Wireless Power Patent Pool
2026-02-24T06:55:00+00:00
-
ASICLAND Signs New Contract with Global Neuromorphic AI Leader BrainChip
2026-02-24T06:41:00+00:00
-
Axelera AI Secures More Than $250 Million Funding on Global Commercial Growth
2026-02-24T06:35:00+00:00
-
Chips&Media Accelerates WAVE-N Ecosystem: Redefining the Future of Next-Generation Customized NPUs
2026-02-24T06:21:26+00:00
-
proteanTecs and Gubo Technologies Collaborate to Deliver Unified Analytics Solution for Advanced Semiconductor Systems
2026-02-23T16:10:00+00:00
-
Cadence Completes Acquisition of Hexagon’s Design and Engineering Business, Advancing Leadership in Physical AI and Multiphysics
2026-02-23T14:44:00+00:00
-
TES Launches its µEngine: Parallel CPU System for Deterministic Real-Time HDL Applications
2026-02-23T13:27:00+00:00
-
PQShield becomes ST Authorized Partner
2026-02-23T12:36:36+00:00
-
sensiBel Licenses Sofics’ Advanced ESD Solutions for their Studio-quality MEMS Microphone Technology
2026-02-23T09:28:20+00:00
-
Socionext and Innatera Introduce Integrated 60 GHz FMCW Radar and Neuromorphic Edge AI for Human Presence Detection
2026-02-23T09:20:40+00:00
-
GenAI for Systems: Recurring Challenges and Design Principles from Software to Silicon
2026-02-23T08:03:00+00:00
-
MIPI Specifications for Embedded Audio, Ambient AI, Smart Camera, IoT and Medical to be Featured at 2026 embedded world Exhibition & Conference
2026-02-23T07:12:01+00:00
-
M31 Validates MIPI M-PHY v5.0 IP on 4nm, Advances 3nm Development to Enable UFS 4.1 Applications
2026-02-23T06:30:00+00:00
-
ASICLAND Partners with Daegu Metropolitan City to Advance Demonstration and Commercialization of Korean AI Semiconductors
2026-02-20T06:39:22+00:00
-
AI is stress-testing processor architectures and RISC-V fits the moment
2026-02-19T12:16:00+00:00
-
Powering the AI Supercycle: Design for AI and AI for Design - Anirudh Devgan
2026-02-19T07:33:10+00:00
-
SEALSQ and Lattice Collaborate to Deliver Unified TPM-FPGA Architecture for Post-Quantum Security
2026-02-19T07:09:00+00:00
The Semiconductor IP Marketplace that puts you first
Semi IP Hub's mission is to provide you with a platform where you can find Silicon IP cores for your next project without being harassed by dozens of sellers.
Here, your contact details are not shared with third parties unless you request to be contacted by a supplier.
Spotlight
-
32Gbps SerDes PHY in GF 22nm
- This 32Gbps SerDes PHY is implemented in GlobalFoundries 22FDX CMOS technology and provides a high-performance, protocol-agnostic serial interface for advanced mixed-signal and high-speed digital SoCs.
- The PHY is architected as a modular design consisting of a low-jitter clock multiplier, a half-rate transmitter with digitally programmable feed-forward equalization, and a configurable CTLE-based receiver with digital clock-and-data recovery, supporting both 16 Gbps and 32 Gbps operation.
-
Multi-channel Ultra Ethernet TSS Transform Engine
- The UET-TSS-IP-69 (EIP-69) is a high-performance, multi-channel transform engine that provides the complete TSS packet transformation (including KDF and IP/UDP updates), bypass/drop and basic crypto processing at rates up to 1.6Tbps.
- The engine is designed for integration into the systems that require TSS processing for one or more ports. The engine is provided as separate ingress and egress data paths.
-
Stand-Alone ESD Cell in GF 28nm
- This ESD library is a silicon-proven set of discrete, pad-independent ESD clamps for GlobalFoundries 28nm technology.
- The library is designed to provide robust ESD protection for power domains and low-speed signals in advanced SoCs where traditional pad-based protection is insufficient or impractical.
-
Configurable CPU tailored precisely to your needs
- Increased efficiency by converting digital design into software development
- Hardware independent and parallel Software development
- Rapid system development and evaluation:
- Software debug and tests with RAISE Simulator
-
Ultra high-performance low-power ADC
- TSMC 28nm
- Ultra high-performance low-power ADC
- 12-bit ADC resolution
- Sampling rate up to 5GSPS
-
HiFi iQ DSP
- 8X Increased AI Performance: Run the entire voice AI networks efficiently with configurable AI-MAC
- 2X Increased Raw Compute Performance: Wider SIMD allows more computations
- Expanded Data Type Support: Efficiently run cutting-edge voice AI models in FP8, BF16, and more
UCIe Controller IP View All
-
UCIe Die-to-Die Chiplet Controller
- High configurability and customizability
- Defines packets to communicate with a link partner using different AXI parameters
- Supports raw streaming modes
- Provides various Flit formats in UCIe v1.1 (filt format 2: 68B flit format, flit format 3/4: standard 256B flit format, and flit format 5/6: latency optimized 256B flit format)
-
UCIe PHY & D2D Adapter
- 32Gbps UCIe-Advanced (UCIe-A) & Standard (UCIe-S)
- UCIe v1.1 specification
-
TSMC CLN5FF GUCIe LP Die-to-Die PHY
- IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face advanced package.
- This GUCIe PHY not only supports UCIe specification rev 1.1 compliance physical layer and Raw D2D interface (RDI) but also optionally provides the
PCIe 7.0 IP View All
-
PCIe 7.0 Controller with AXI
- Optimized for high-bandwidth efficiency at data rates up to 128 GT/s
- Separate native TX/RX data path separating posted/Non posted/completion traffic
- Handles up to 4 TLPs per cycle
- Advanced PIPE modes and port bifurcation
-
PCIe 7.0 PHY IP
- Physical Coding Sublayer (PCS) block with PIPE interface
- Supports PCIe 7.0, encoding, backchannel initialization
- Lane margining at the receiver
-
PCIe 7.0 PHY in TSMC (N5, N3P)
- Physical Coding Sublayer (PCS) block with PIPE interface
- Supports PCIe 7.0, encoding, backchannel initialization
- Lane margining at the receiver
- Spread-spectrum clocking (SSC)
AI IP View All
-
RISC-V CPU IP
- RISC-V RVA23 Compliant
- >18 SPECint2006/GHz
- 8-wide decode unit
- Advanced branch predictor
-
NPU IP for Embedded ML
- Fully programmable to efficiently execute Neural Networks, feature extraction, signal processing, audio and control code
- Scalable performance by design to meet wide range of use cases with MAC configurations with up to 64 int8 (native 128 of 4x8) MACs per cycle
- Future proof architecture that supports the most advanced ML data types and operators
-
Future-proof IP for training and inference with leading performance per watt and per dollar
- RISC-V-based AI IP development for enhanced training and inference.
- Silicon-proven solutions tailored for AI workload optimization.
- Energy-efficient performance with industry-leading Perf/W.
MIPI IP View All
-
MIPI C-PHY/D-PHY Combo CSI-2 RX+ IP (6.0Gsps/trio, 4.5Gbps/lane) in TSMC N6
- Dual mode PHY Supports MIPI Alliance Specification D-PHY v2.5 & C-PHY v2.0
- Consists of 1 Clock lane and 4 Data lanes in D-PHY mode
-
MIPI CSI-2 controller Receiver v 2.1, Compatible with MIPI C-PHY v1.2 & DPHY v2.1.
- Fully compliant to MIPI standard
- Small footprint
- Code validated with Spyglass
-
MIPI D-PHY IP for TSMC (5nm, 6/7nm, 12/16nm, 22nm, 28nm, 40nm)
- Compliant to MIPI Alliance Standard for D-PHY specification Version 2.1, 1.2, 1.1
- Supports standard PHY transceiver compliant to MIPI Specification
- Supports standard PPI interface compliant to MIPI Specification
- Supports synchronous transfer at high speed mode with a bit rate of 80-2500 Mb/s
RISC-V IP View All
-
32b/64b RISC-V 5-stage, scalar, in-order, Application Processor. Linux and multi-core capable. Maps upto ARM A-35. Optimal PPA.
- 32/64 Bit RISC-V core
- 5-stage pipeline
- In-order, Single issue
- Multicore Capable (up to 8 cores)
-
Dual-issue Linux-capable RISC-V core
- 64-bit RISC-V core
- RVA22 profile
- Linux capable
-
High-performance RISC-V CPU
- Fully compliant with the RVA23 RISC-V specification
- Comparable PPA to Arm Neoverse V3 / Cortex-X4
- Standard AMBA CHI.E coherent interface for SoC and chiplet integration
- Co-architected with Veyron E2 for seamless vector, AI acceleration, and big-little style heterogeneous compute configurations