The Pulse
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SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027
2026-04-01T15:13:47+00:00
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Intel to Repurchase 49% Equity Interest in Ireland Fab Joint Venture
2026-04-01T15:07:42+00:00
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The 5 Biggest Challenges in Modern SoC Design (And How to Solve Them)
2026-04-01T12:43:07+00:00
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AGI CPU: Arm’s $100B AI Silicon Tightrope Walk Without Undermining Its Licensees
2026-04-01T05:42:24+00:00
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A Lightweight High-Throughput Collective-Capable NoC for Large-Scale ML Accelerators
2026-04-01T05:02:00+00:00
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EnSilica selected for UK CHERI Adoption Collective
2026-03-31T11:36:54+00:00
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CHIPS Alliance launches the SV Tools Project for open source development of SystemVerilog/UVM codebases
2026-03-31T06:52:00+00:00
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Quantifying Uncertainty in FMEDA Safety Metrics: An Error Propagation Approach for Enhanced ASIC Verification
2026-03-31T06:33:00+00:00
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Can Your NPU Run DOOM? Chimera Can.
2026-03-31T06:29:00+00:00
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Socionext Collaborates with Arm to Advance AI Data Center Infrastructure with Arm Total Design
2026-03-31T06:07:07+00:00
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EDGEAI to Revolutionize Smart Metering with BrainChip Akida 2 License
2026-03-30T13:47:00+00:00
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Importance Of Hardware Security Verification In Pre-Silicon Design
2026-03-30T11:27:31+00:00
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Arteris × XuanTie: The “Data Highway” for High-Performance RISC-V SoCs
2026-03-30T11:22:13+00:00
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IC Manage Advances GDP-XL to GDP-AI — Boosting Designer Efficiency and Accelerating Workflows
2026-03-30T07:35:26+00:00
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SoK: From Silicon to Netlist and Beyond Two Decades of Hardware Reverse Engineering Research
2026-03-30T06:18:19+00:00
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Why Did Weebit Raise Capital Now?
2026-03-30T05:40:00+00:00
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Safe and Secure Technologies, the new BSC and UPC spin-off that will design chips for critical sectors where “failure is not an option”
2026-03-27T12:21:00+00:00
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CHERI-Mocha memory-safe compute subsystem is now open
2026-03-27T06:36:01+00:00
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GlobalFoundries Files Patent Infringement Lawsuits Against Tower Semiconductor to Protect High-Performance American Chip Innovation
2026-03-26T16:21:00+00:00
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Weebit Nano announces A$80.0 million Placement
2026-03-26T12:36:00+00:00
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Building Secure Chips: Why Hardware Security Assurance Is Now Essential
2026-03-26T12:28:51+00:00
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Joya Design Takes Neuromorphic Chip from Design to Device with First Innatera-Powered Consumer Audio Product at AWE China
2026-03-25T12:26:01+00:00
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Arm expands compute platform to silicon products
2026-03-24T19:24:00+00:00
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Synopsys Supports New Arm AGI CPU with Full-Stack Design Solutions
2026-03-24T18:51:00+00:00
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Announcing Arm AGI CPU: The silicon foundation for the agentic AI cloud era
2026-03-24T18:29:57+00:00
The Semiconductor IP Marketplace that puts you first
Semi IP Hub's mission is to provide you with a platform where you can find Silicon IP cores for your next project without being harassed by dozens of sellers.
Here, your contact details are not shared with third parties unless you request to be contacted by a supplier.
Spotlight
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6-bit, 12 GSPS Flash ADC - GlobalFoundries 22nm
- 6-bit resolution
- 12 GSPS sampling rate
- 10 GHz Input Bandwidth
- 13 mW Power
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ECDSA (Elliptic Curve Digital Signature) IP Core
- Full ECDSA implementation adhering to Standards for Efficient Cryptography (SEC)
- Bitcoin algorithm support
- Technology-independent HDL model
- Simple external interface for easy adaptation
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LunaNet AFS LDPC Encoder and Decoder IP Core
- Rate 1/2
- GNSS, AFS
- Subframe 2/3/4
- Low implementation loss
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Universal Chiplet Interconnect Express PHY IP - GLOBALFOUNDRIES® 22FDX®
- Delivered as Hardmacro IP
- Implementation of the physical layer of the UCIe standard from Raw D2D Interface (RDI) to electrical interface of UCIe main band (MB) and sideband (SB)
- Includes TX and RX side
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ReRAM NVM in DB HiTek 130nm BCD
- 10K cycles endurance
- >10 years retention at 125°C
- Ultra-low power consumption
- Low-cost NVM – requires only two additional masks
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Crystal Oscillator for a 32 kHz Crystal - GLOBALFOUNDRIES® 22FDX®
- Specific crystal: 32 kHz
- Supported series resistance: up to 100 kOhm
- Supported load capacitance: 3 pF to 12.5 pF
- Startup time: 59 ms (TT, 12 pF) depending on crystal and PCB
UCIe Controller IP View All
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UCIe Die-to-Die Chiplet Controller
- High configurability and customizability
- Defines packets to communicate with a link partner using different AXI parameters
- Supports raw streaming modes
- Provides various Flit formats in UCIe v1.1 (filt format 2: 68B flit format, flit format 3/4: standard 256B flit format, and flit format 5/6: latency optimized 256B flit format)
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UCIe PHY & D2D Adapter
- 32Gbps UCIe-Advanced (UCIe-A) & Standard (UCIe-S)
- UCIe v1.1 specification
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TSMC CLN5FF GUCIe LP Die-to-Die PHY
- IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face advanced package.
- This GUCIe PHY not only supports UCIe specification rev 1.1 compliance physical layer and Raw D2D interface (RDI) but also optionally provides the
PCIe 7.0 IP View All
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PCIe 7.0 Controller with AXI
- Optimized for high-bandwidth efficiency at data rates up to 128 GT/s
- Separate native TX/RX data path separating posted/Non posted/completion traffic
- Handles up to 4 TLPs per cycle
- Advanced PIPE modes and port bifurcation
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PCIe 7.0 PHY IP
- Physical Coding Sublayer (PCS) block with PIPE interface
- Supports PCIe 7.0, encoding, backchannel initialization
- Lane margining at the receiver
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PCIe 7.0 PHY in TSMC (N5, N3P)
- Physical Coding Sublayer (PCS) block with PIPE interface
- Supports PCIe 7.0, encoding, backchannel initialization
- Lane margining at the receiver
- Spread-spectrum clocking (SSC)
AI IP View All
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RISC-V CPU IP
- RISC-V RVA23 Compliant
- >18 SPECint2006/GHz
- 8-wide decode unit
- Advanced branch predictor
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NPU IP for Embedded ML
- Fully programmable to efficiently execute Neural Networks, feature extraction, signal processing, audio and control code
- Scalable performance by design to meet wide range of use cases with MAC configurations with up to 64 int8 (native 128 of 4x8) MACs per cycle
- Future proof architecture that supports the most advanced ML data types and operators
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Future-proof IP for training and inference with leading performance per watt and per dollar
- RISC-V-based AI IP development for enhanced training and inference.
- Silicon-proven solutions tailored for AI workload optimization.
- Energy-efficient performance with industry-leading Perf/W.
MIPI IP View All
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MIPI C-PHY/D-PHY Combo CSI-2 RX+ IP (6.0Gsps/trio, 4.5Gbps/lane) in TSMC N6
- Dual mode PHY Supports MIPI Alliance Specification D-PHY v2.5 & C-PHY v2.0
- Consists of 1 Clock lane and 4 Data lanes in D-PHY mode
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MIPI CSI-2 controller Receiver v 2.1, Compatible with MIPI C-PHY v1.2 & DPHY v2.1.
- Fully compliant to MIPI standard
- Small footprint
- Code validated with Spyglass
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MIPI D-PHY IP for TSMC (5nm, 6/7nm, 12/16nm, 22nm, 28nm, 40nm)
- Compliant to MIPI Alliance Standard for D-PHY specification Version 2.1, 1.2, 1.1
- Supports standard PHY transceiver compliant to MIPI Specification
- Supports standard PPI interface compliant to MIPI Specification
- Supports synchronous transfer at high speed mode with a bit rate of 80-2500 Mb/s
RISC-V IP View All
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32b/64b RISC-V 5-stage, scalar, in-order, Application Processor. Linux and multi-core capable. Maps upto ARM A-35. Optimal PPA.
- 32/64 Bit RISC-V core
- 5-stage pipeline
- In-order, Single issue
- Multicore Capable (up to 8 cores)
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Dual-issue Linux-capable RISC-V core
- 64-bit RISC-V core
- RVA22 profile
- Linux capable
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High-performance RISC-V CPU
- Fully compliant with the RVA23 RISC-V specification
- Comparable PPA to Arm Neoverse V3 / Cortex-X4
- Standard AMBA CHI.E coherent interface for SoC and chiplet integration
- Co-architected with Veyron E2 for seamless vector, AI acceleration, and big-little style heterogeneous compute configurations