NFC IP
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NFC IP
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NTN System Test Bench
- Allows end-to-end testing of NB-IoT NTN system in lab environment.
- supports 3GPP® Release 17 and 18 standards.
- supports LEO transparent or regenerative modes of operation.
- multiple-instancing and virtualisation to simulate UE community.
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NTN eNodeB System Test Bench
- Allows end-to-end testing of NB-IoT NTN system in lab environment.
- supports 3GPP® Release 17 and 18 standards.
- supports LEO transparent or regenerative modes of operation.
- multiple-instancing and virtualisation to simulate UE community.
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LTE IP
- Scalable and robust LTE IP for seamless 4G wireless communications integration.
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NFC/RFID Transceiver
- UMC CMOS 180 nm technology
- Supports ISO14443A* and ISO14443B standards in both reader and card emulation mode
- Supports NFC Initiator in both Active and Passive modes with speeds 212 and 424 Kbps
- Supports NFC Target in both Active and Passive modes with speeds 212 and 424 Kbps
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NFC/RFID Controller
- UMC CMOS 180 nm technology
- Complete RFID reader solution, including RF front-end and 8051-based MCU
- Supports ISO14443A* and ISO14443B standards in both reader and card emulation mode
- Supports NFC Initiator in both Active and Passive modes with speeds 212 and 424 Kbps
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Ethernet 1G/2.5G/5G/10G/25G and CPRI 7.0 PCS
- Delivers Performance
- Feature Rich
- Highly Configurable
- Silicon Agnostic
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Narrow band - IoT Ultra-Low power UE RF Transceiver IP
- Frequency Range: 100MHz - 2.6GHz
- Bandwidth Range: 180KHz ~ 20MHz
- Silicon proven in TSMC 40ULP
- Supports both HD-FDD/TDD modes.
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LTE Release-9 UE PHY. (L1) IP
- 3GPP Release 9 compliant
- Category 4
- 2×2 MIMO and SISO support
- 2 Tx and 2 Rx
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LTE Release-9 UE Protocol Stack (L2-L3) SW IP
- 3GPP Release 9 compliant
- Category 4
- 2×2 MIMO
- 2 Tx and 2 Rx
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LTE Release-10 Baseband Protocol Stack (L2-L3) SW IP
- Modular design with low power radio module that supports all LTE bands.
- Radio front end available for Band 28, Band 7, Band 40
- Hardware capable of single or 3 sector operation.
- Interoperated with majority of the UE chip vendors.