UCIe Die-to-Die Chiplet Controller
The UCIe Controller IP is a configurable and customizable UCIe 1.1 compliant die-to-die controller.
- UCIe
- Available on request
- UCIe 1.1
UCIe IP cores enable high-bandwidth die-to-die connectivity in advanced packaging and chiplet architectures in modern SoC and ASIC designs.
These IP cores support standardized die-to-die connectivity for chiplet-based architectures with high bandwidth and ecosystem interoperability, helping designers scale heterogeneous integration with better bandwidth density, packaging flexibility, and subsystem reuse
This catalog allows you to compare UCIe IP cores from leading vendors based on bandwidth, latency, power efficiency, and process node compatibility.
Whether you are designing chiplet SoCs, AI packages, data-center processors, or advanced packaging platforms, you can find the right UCIe IP for your application.
UCIe Die-to-Die Chiplet Controller
The UCIe Controller IP is a configurable and customizable UCIe 1.1 compliant die-to-die controller.
The ODT-UCIE-UNI-TX-16GXX-16FFCT is a low power D2D transmitter IP in TSMC 16FFC process.
The ODT- UCIE-UNI-RX-16GXX-S8 is a low power D2D receiver IP in Samsung 8nm process.
Industry , AXI5-Stream Solution for UCIe D2D Stacks The AXI-S Protocol Layer for UCIe is a protocol adapter layer between a Strea…
Accelerated confidence in simulation-based verification of RTL designs with Universal Chiplet Interconnect Express (UCIe) interfa…
The UCIe Chiplet IP offers a cutting-edge solution for seamless, low-latency data transfer between dies and chips, enabling heter…
Industry , Silicon Proven, 32 Gbps per pin, backed by a portfolio of verification tools, PHY interoperability and integration.
Universal Chiplet Interconnect Express (UCIe™) Controller
High-bandwidth, low-power and low-latency standardized die-to-die interconnect The Cadence UCIe™ PHY is a high-bandwidth, low-pow…
Universal Chiplet Interconnect Express PHY IP - GLOBALFOUNDRIES® 22FDX®
The Racyics UCIe PHY is an energy-efficient chiplet interconnect IP solution for consumer and automotive applications.
TSMC CLN5FF GUCIe LP Die-to-Die PHY
IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face package.
Universal Chiplet Interconnect Express(UCIe) VIP
The UCIe VIP , a solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of y…
The UCIe IP solution includes D2D Adapter layer which supports streaming/PCIe/CXL/Raw flitformats, supports both standard and mai…
UCIe D2D Adapter & PHY Integrated IP
A UCIe solution ready to support any protocol layer The D2D Adapter for UCIe combined with the UCIe PHY from a UCIe solution read…
The UCIe PHY IP enables high-bandwidth, low-latency die-to-die communication across chiplets, fully compliant with the Universal …
UCIe Controller add-on CXL2 Protocol Layer
The UCIe Controller IP encompasses the Die-to-Die Adapter Layer and Protocol Layer for widely used protocols, such as PCI Express…
UCIe Controller add-on CXL3 Protocol Layer
The UCIe Controller IP encompasses the Die-to-Die Adapter Layer and Protocol Layer for widely used protocols, such as PCI Express…
UCIe Controller baseline for Streaming Protocols for ASIL B Compliant, AEC-Q100 Grade 2
The UCIe Controller IP encompasses the Die-to-Die Adapter Layer and Protocol Layer for widely used protocols, such as PCI Express…
UCLe - Ensures reliable validation and efficient connectivity for chiplets
UCIe VIP is a solution for validating and ensuring compliance in multi-chip semiconductor systems.
Best-in-Class UCIe Verification IP for your IP, SoC, and System-Level Design Testing The Cadence Verification IP (VIP) for Univer…
The UCIe Verification IP provides an effective & efficient way to verify the UCIe components of an IP or SoC.