Why Security Can't Exist Without Trust
April 21, 2026
Semi IP Hub Industry Expert Blogs
Universal Browser Support for JPEG XL: Is Your Hardware Ready for the New Standard?
April 20, 2026
The Future of Storage: From eMMC to the Blazing Speeds of UFS 5.0
April 17, 2026
Reimagining Chip Design - From Spec to Signoff with Cadence AI Super Agents
April 17, 2026
The Architectural Evolution of 16GHz PLLs for Next-Gen AI and SerDes SoCs
April 15, 2026
Considerations When Architecting Your Next SoC: NoCs with Arteris
April 14, 2026
Implementing Dual-core Lockstep in the CHIPS Alliance VeeR EL2 RISC-V core for safety-critical applications
April 14, 2026
Rethinking Display Safety: Why RISC-V-Supervised DisplayPort Subsystems Enable Secure, Isolated Automotive Architectures
April 14, 2026
Area, Pipelining, Integration: A Comparison of SHA-2 and SHA-3 for embedded Systems.
April 9, 2026
Why Your Next Smartphone Needs Micro-Cooling
April 9, 2026
Teaching AI Agents to Speak Hardware
April 9, 2026
SOCAMM: Modernizing Data Center Memory with LPDDR6/5X
April 9, 2026
Bridging the Gap: Why eFPGA Integration is a Managed Reality, Not a Schedule Risk
April 9, 2026
When a Platform Provider Becomes a Competitor: Why Arm’s Silicon Strategy Changes the Incentives
April 8, 2026
The Architectural Evolution of 16GHz PLLs for Next-Gen AI and SerDes SoCs
April 7, 2026
On-Device AI Semiconductors & High-speed Interconnects in the Physical AI era
April 7, 2026
Google, Quantum Attacks, and ECDSA: Why There’s No Need to Panic and Why Preparation Matters Now
April 6, 2026
One PHY, Zero Tradeoffs: Multi-Protocol PHY for Edge AI Interface Consolidation
April 6, 2026
What is the EDA problem worth solving with AI?
April 2, 2026
Synopsys Advances Die‑to‑Die Connectivity with 64G UCIe IP Tape‑Out
April 2, 2026
