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Compare 33 Other from 7 vendors (1 - 10)
  • Die-to-Memory (D2M) PHY
    • Unlike fixed unidirectional die-to-die solutions, NuLink technology is able to deliver low-power and high-performance D2M solutions.
    Block Diagram -- Die-to-Memory (D2M) PHY
  • Die-to-Die PHY
    • The NuLink technology delivers low-power and high-performance D2D IP core products, which support multiple industry standards and are available on both standard and advanced packaging.
    Block Diagram -- Die-to-Die PHY
  • <4Gbps Low Power D2D Interface in TSMC 16nm & 28nm
    • A <4Gbps, Wide I/O Compatible, Die to Die Interface in TSMC 16nm and 28nm.
    • This silicon proven die to die interface includes IP in both TSMC 16nm FFC/FFC+ and 28nm HPM/HPC/HPC+.
    • The I/O cells for both versions of the library are defined as TX only and RX only.
    Block Diagram -- <4Gbps Low Power D2D Interface in TSMC 16nm & 28nm
  • Low Power D2D Interface in TSMC 16nm FFC/FFC+
    • This library is a production-quality, silicon-proven custom Die-to-Die high speed interface available in TSMC’s 16nm process.
    • The I/O cell is bidirectional, has two modes of operation: standard full rail to rail swing, or a custom low noise pseudo-differential interface.
    • The RX cells have a weak pull-down feature.
    Block Diagram -- Low Power D2D Interface in TSMC 16nm FFC/FFC+
  • Die-to-Die, High Bandwidth Interconnect PHY Ported to TSMC N7 X24
    • Delivers up to 4Gbps per pin with up to bidirectional 2 Tbps/mm of die edge
    • High-bandwidth, low-power, low-latency multi-channel PHY in applications requiring connections between dies within a package
    • Compliant with Intel Advanced Interface Bus (AIB) v1.1 standard
    • Compliant with IEEE 1149.1 (JTAG), 1149.6 (AC JTAG) for easy integration with SoC testability framework
    Block Diagram -- Die-to-Die, High Bandwidth Interconnect PHY Ported to TSMC N7 X24
  • Die-to-Die, High Bandwidth Interconnect PHY Ported to TSMC N5 X24, North/South (vertical) poly orientation
    • Delivers up to 4Gbps per pin with up to bidirectional 2 Tbps/mm of die edge
    • High-bandwidth, low-power, low-latency multi-channel PHY in applications requiring connections between dies within a package
    • Compliant with Intel Advanced Interface Bus (AIB) v1.1 standard
    • Compliant with IEEE 1149.1 (JTAG), 1149.6 (AC JTAG) for easy integration with SoC testability framework
    Block Diagram -- Die-to-Die, High Bandwidth Interconnect PHY Ported to TSMC N5 X24, North/South (vertical) poly orientation
  • Die-to-Die, AIB 2.0 PHY Ported to Intel 16, North/South (vertical) poly orientation
    • Delivers up to 4Gbps per pin with up to bidirectional 2 Tbps/mm of die edge
    • High-bandwidth, low-power, low-latency multi-channel PHY in applications requiring connections between dies within a package
    • Compliant with Intel Advanced Interface Bus (AIB) v1.1 standard
    • Compliant with IEEE 1149.1 (JTAG), 1149.6 (AC JTAG) for easy integration with SoC testability framework
    Block Diagram -- Die-to-Die, AIB 2.0 PHY Ported to Intel 16, North/South (vertical) poly orientation
  • Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N7 X16, North/South (vertical) poly orientation
    • 16-lane TX and RX square macros for placement in any edge of the die
    • Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
    • Implements NRZ and PAM-4 signaling
    • Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
    Block Diagram -- Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N7 X16, North/South (vertical) poly orientation
  • Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N6 X16, North/South (vertical) poly orientation
    • 16-lane TX and RX square macros for placement in any edge of the die
    • Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
    • Implements NRZ and PAM-4 signaling
    • Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
    Block Diagram -- Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N6 X16, North/South (vertical) poly orientation
  • Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N5 X16, North/South (vertical) poly orientation
    • 16-lane TX and RX square macros for placement in any edge of the die
    • Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
    • Implements NRZ and PAM-4 signaling
    • Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
    Block Diagram -- Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N5 X16, North/South (vertical) poly orientation
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