Omni Design Technologies Advances 200G-Class Co-Packaged Optics IP Portfolio for Next-Generation AI Infrastructure
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Fraunhofer IPMS develops new 10G TSN endpoint IP Core for deterministic high-speed Ethernet networks
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MING: An Automated CNN-to-Edge MLIR HLS framework
2026-02-16T09:16:51+00:00
Fraunhofer IPMS develops new 10G TSN endpoint IP Core for deterministic high-speed Ethernet networks
2026-02-16T07:30:07+00:00
A new CEO, a cleared deck: Is Imagination finally ready for a deal?
2026-02-14T07:21:00+00:00
SkyeChip’s UCIe 3.0 Advanced Package PHY IP for SF4X Listed on Samsung Foundry CONNECT
2026-02-13T09:45:00+00:00
Fault Tolerant Design of IGZO-based Binary Search ADCs
2026-02-13T07:42:49+00:00
Victor Peng Joins Rambus Board of Directors
2026-02-13T06:45:43+00:00
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Arteris Network-on-Chip Technology Achieves Deployment Milestone of 4 Billion Chips and Chiplets
2026-02-13T06:06:23+00:00
Accelerating Post-Quantum Cryptography via LLM-Driven Hardware-Software Co-Design
2026-02-12T16:39:00+00:00
Scaling AI from Edge to Data Center with SiFive RISC-V Vectors
2026-02-12T06:56:13+00:00
RISC-V Pivots from Academia to Industrial Heavyweight
2026-02-12T06:17:00+00:00
Arteris Technology Deployed More Broadly by NXP to Accelerate Edge AI Leadership
2026-02-12T05:52:00+00:00
Leadership in CAN XL strengthens Bosch’s position in vehicle communication
2026-02-11T12:11:21+00:00
Validating UPLI Protocol Across Topologies with Cadence UALink VIP
2026-02-11T11:58:46+00:00
Cadence Tapes Out 32GT/s UCIe IP Subsystem on Samsung 4nm Technology
2026-02-11T11:38:00+00:00
Marvell Completes Acquisition of XConn Technologies
2026-02-11T09:11:05+00:00
IFV: Information Flow Verification at the Pre-silicon Stage Utilizing Static-Formal Methodology
2026-02-11T08:27:07+00:00
LPDDR6 vs. LPDDR5 and LPDDR5X: What’s the Difference?
2026-02-11T07:27:54+00:00
Rambus Announces Departure of Chief Financial Officer
2026-02-11T07:21:04+00:00
DEEPX, Rambus, and Samsung Foundry Collaborate to Enable Efficient Edge Inferencing Applications
2026-02-11T07:10:00+00:00
AI Elevates Production Management’s Importance in the ASIC Value Chain
2026-02-10T14:29:00+00:00
Cadence Unleashes ChipStack AI Super Agent, Pioneering a New Frontier in Chip Design and Verification
2026-02-10T14:17:00+00:00
Faraday Reports Fourth Quarter 2025 Results
2026-02-10T13:48:00+00:00
Passing the Torch: Reflections on ARC’s Journey and the Future of Specialized Processing
2026-02-10T13:19:50+00:00
Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected Home
2026-02-10T12:34:21+00:00
CES 2026 Recap: Trust Built on a Real, Working eUSB2V2 System Demo
2026-02-10T08:54:00+00:00
TES offers a programmable precision DC voltage amplifier IP for X-FAB’s XT018 technology
2026-02-10T08:35:52+00:00
System-Level Isolation for Mixed-Criticality RISC-V SoCs: A "World" Reality Check
2026-02-10T07:57:19+00:00
CVA6-CFI: A First Glance at RISC-V Control-Flow Integrity Extensions
2026-02-10T07:30:00+00:00