UCIe-S PHY for Standard Package (x32) in TSMC (N3P)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
- TSMC
- 3nm
- N3P
UCIe IP cores enable high-bandwidth die-to-die connectivity in advanced packaging and chiplet architectures in modern SoC and ASIC designs.
These IP cores support standardized die-to-die connectivity for chiplet-based architectures with high bandwidth and ecosystem interoperability, helping designers scale heterogeneous integration with better bandwidth density, packaging flexibility, and subsystem reuse
This catalog allows you to compare UCIe IP cores from leading vendors based on bandwidth, latency, power efficiency, and process node compatibility.
Whether you are designing chiplet SoCs, AI packages, data-center processors, or advanced packaging platforms, you can find the right UCIe IP for your application.
UCIe-S PHY for Standard Package (x32) in TSMC (N3P)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-S PHY for Standard Package (x16) for Automotive in TSMC (N5A)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in TSMC (N7, N6, N5, N3)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-S PHY for Standard Package (x16) in TSMC (N7, N6, N4P, N5, N3)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
The ODT-UCIE-UNI-TX-16GXX-16FFCT is a low power D2D transmitter IP in TSMC 16FFC process.
The ODT- UCIE-UNI-RX-16GXX-S8 is a low power D2D receiver IP in Samsung 8nm process.
UCIe Die-to-Die Chiplet Controller
The UCIe Controller IP is a configurable and customizable UCIe 1.1 compliant die-to-die controller.
UCIe-A PHY for Advanced Package (x64) in Samsung (SF2)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in TSMC (N5)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in Samsung (SF4X)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-S PHY for Standard Package (x16) in Samsung (SF5A, SF4X, SF2)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
High-Performance AXI to UCIe FDI Interface IP for Scalable System Integration
45SPCLO UCIe-Class 1-32Gbps Low Power Receiver IP (NRZ)
UCIe-Class receiver macro on GF 45SPCLO technology node supporting from 1 to 32Gbps with 70mV sensitivity
45SPCLO UCIe-Class 1-32Gbps Low Power Transmitter IP (NRZ)
UCIe-Class transmitter macro on GF 45SPCLO technology node supporting from 1 to 32Gbps with 800mVpp single ended
Universal Chiplet Interconnect Express PHY IP - GLOBALFOUNDRIES® 22FDX®
UCIe PHY IP with X16 data width for standard package and up to 8 Gbit/s per pin data rate
Industry , AXI5-Stream Solution for UCIe D2D Stacks The AXI-S Protocol Layer for UCIe is a protocol adapter layer between a Strea…
TSMC CLN5FF GUCIe LP Die-to-Die PHY
IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face package.
Accelerated confidence in simulation-based verification of RTL designs with Universal Chiplet Interconnect Express (UCIe) interfa…
The UCIe Chiplet IP offers a cutting-edge solution for seamless, low-latency data transfer between dies and chips, enabling heter…
Industry , Silicon Proven, 32 Gbps per pin, backed by a portfolio of verification tools, PHY interoperability and integration.