The Pulse
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SmartDV宣布其MIPI® SoundWire® I3S℠ 1.0 IP产品组合已向多家客户提供授权
2025-11-07T08:15:52+00:00
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Perceptia 更新基于格芯(GlobalFoundries)22FDX工艺平台的 pPLL03 设计套件
2025-11-06T01:22:00+00:00
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〈M31法說〉先進製程與權利金雙引擎 2025全年營收維持20%成長目標
2025-11-05T08:19:15+00:00
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Altera采用Arteris赋能云到边缘应用的智能计算
2025-11-05T06:12:00+00:00
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熵碼科技PUFrt技術助力Silicon Labs第三代無線SoC在全球率先通過 PSA Certified Level 4 認證
2025-10-31T12:40:27+00:00
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SmartDV以领先的半导体设计IP与验证解决方案持续深耕亚洲市场
2025-10-31T07:48:00+00:00
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Arteris与阿里巴巴达摩院深化合作,加速高性能RISC-V SoC设计
2025-10-23T13:47:44+00:00
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Perceptia 基于格芯22FDX工艺的 pPLL08W初期性能测试报告正式发布
2025-10-23T05:53:30+00:00
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聯電推出55奈米BCD平台 提升行動裝置、消費性電子與汽車應用的電源效率
2025-10-22T06:27:19+00:00
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ChipAgents完成超额认购的2100万美元A轮融资,致力于以全新方式重塑芯片设计中的人工智能应用
2025-10-22T05:29:28+00:00
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GUC日本横滨新办公室盛大启用 持续深化在日布局与客户合作
2025-10-20T06:58:00+00:00
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Quintauris 與晶心科技攜手合作,擴展 RISC-V 生態系統
2025-10-14T05:36:00+00:00
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积极拥抱RISC-V+AI,国芯科技高性能汽车智能域控 AI MCU芯片完成设计进入流片试制阶段
2025-10-13T13:46:00+00:00
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晶心科技與 Arculus System 攜手合作將 iPROfiler™ 整合進 AndeSysC 擴展虛擬平台支援助攻 RISC-V SoC 設計
2025-10-13T11:38:00+00:00
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Perceptia pPLL08W 成功应用于智能手机 5G 射频芯片量产流片
2025-10-09T03:04:00+00:00
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創意電子公佈民國114 年9 月份營收報告
2025-10-07T12:07:00+00:00
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安谋科技发布CPU IP “星辰”STAR-MC3,提升传统嵌入式芯片AI处理能力及面效比
2025-09-30T13:35:00+00:00
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国产领军的全功能 GPU “风华3号” 重磅发布,多个第一赋能千行百业人工智能+
2025-09-29T11:11:00+00:00
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Allegro DVT 推出全面合规测试工具,支持 AV2 标准生态系统
2025-09-25T12:38:00+00:00
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锐成芯微推出MIPI A-PHY IP:搭建汽车电子高效数据传输网络
2025-09-25T11:43:00+00:00
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Perceptia Devices 推出 pPLL08N:紧凑型窄带射频锁相环(RF PLL)系列 IP,进一步完善 pPLL08 产品线
2025-09-25T05:00:00+00:00
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芯原推出基于FD-SOI工艺的无线IP平台,支持多样化物联网及消费电子应用
2025-09-24T05:09:00+00:00
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MIPI A-PHY达成里程碑,成为首个获全球汽车OEM采用并进入量产的SerDes标准
2025-09-23T05:40:00+00:00
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Silicon Creations在台积电FinFET工艺上完成第 1000 个项目量产流片,完整 N2 工艺 IP 库同步上线
2025-09-17T12:30:00+00:00
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Perceptia Devices 正式启动将 pPLL03 移植至三星 8 纳米工艺平台
2025-09-11T03:50:00+00:00
The Semiconductor IP Marketplace that puts you first
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Here, your contact details are not shared with third parties unless you request to be contacted by a supplier.
Spotlight
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MIPI SoundWire I3S Peripheral IP
- The MIPI SoundWire I3S Peripheral IP delivers seamless, low-power, and high-quality audio connectivity for a range of mobile, consumer, and automotive devices.
- Fully compliant with the MIPI SoundWire I3S (Inter-IC Sound) specifications, it enables synchronized, multi-channel audio communication with a compact and efficient two-wire interface, ideal for integrating digital microphones, amplifiers, or audio codecs.
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ML-DSA Digital Signature Engine
- The KiviPQC™-DSA is a hardware accelerator for post-quantum cryptographic operations.
- It implements the Module Lattice-based Digital Signature Algorithm (ML-DSA), standardized by NIST in FIPS 204.
- This mechanism realizes the appropriate procedures for securely generating a private/public key pair, digitally signing a message or a data block, and performing digital signature verification.
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P1619 / 802.1ae (MACSec) GCM/XTS/CBC-AES Core
- Small size: From 70K ASIC gates (at throughput of 18.2 bits per clock)
- 500 MHz frequency in 90 nm process
- Easily parallelizable to achieve higher throughputs
- Completely self-contained: does not require external memory. Includes encryption, decryption, key expansion and data interface
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LPDDR6/5X/5 Controller IP
- Supports JEDEC standard LPDDR6, LPDDR5X and LPDDR5 SDRAMs
- Support for data rates up to 14.4 Gbps for LPDDR6, 10.67 Gbps for LPDDR5X, and 6.4 Gbps for LPDDR5
- Multiport Arm® AMBA® interface AXI™4 with managed QoS or single-port host interface to the DDR controller
- DFI 5.2 compliant interface to Synopsys LPDDR6/5X/5 PHY
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Post-Quantum ML-KEM IP Core
- Efficient Performance
- SCA/FIA Protections
- Patented High-Performance Modulo Multiplication
- Flexible Interfaces
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MIPI SoundWire I3S Manager IP
- The MIPI SoundWire I3S Manager IP enables efficient, low-power, and high-fidelity audio data transfer for mobile, consumer, and automotive applications.
- Compliant with the MIPI SoundWire I3S (Inter-IC Sound) standards, it supports synchronized, multi-channel audio over a scalable two-wire interface, ideal for connecting digital microphones, amplifiers, and codecs in space-constrained designs.
UCIe Controller IP View All
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UCIe Die-to-Die Chiplet Controller
- High configurability and customizability
- Defines packets to communicate with a link partner using different AXI parameters
- Supports raw streaming modes
- Provides various Flit formats in UCIe v1.1 (filt format 2: 68B flit format, flit format 3/4: standard 256B flit format, and flit format 5/6: latency optimized 256B flit format)
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UCIe PHY & D2D Adapter
- 32Gbps UCIe-Advanced (UCIe-A) & Standard (UCIe-S)
- UCIe v1.1 specification
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TSMC CLN5FF GUCIe LP Die-to-Die PHY
- IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face advanced package.
- This GUCIe PHY not only supports UCIe specification rev 1.1 compliance physical layer and Raw D2D interface (RDI) but also optionally provides the
PCIe 7.0 IP View All
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PCIe 7.0 Controller with AXI
- Optimized for high-bandwidth efficiency at data rates up to 128 GT/s
- Separate native TX/RX data path separating posted/Non posted/completion traffic
- Handles up to 4 TLPs per cycle
- Advanced PIPE modes and port bifurcation
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PCIe 7.0 PHY IP
- Physical Coding Sublayer (PCS) block with PIPE interface
- Supports PCIe 7.0, encoding, backchannel initialization
- Lane margining at the receiver
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PCIe 7.0 PHY in TSMC (N5, N3P)
- Physical Coding Sublayer (PCS) block with PIPE interface
- Supports PCIe 7.0, encoding, backchannel initialization
- Lane margining at the receiver
- Spread-spectrum clocking (SSC)
AI IP View All
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RISC-V CPU IP
- RISC-V RVA23 Compliant
- >18 SPECint2006/GHz
- 8-wide decode unit
- Advanced branch predictor
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NPU IP for Embedded ML
- Fully programmable to efficiently execute Neural Networks, feature extraction, signal processing, audio and control code
- Scalable performance by design to meet wide range of use cases with MAC configurations with up to 64 int8 (native 128 of 4x8) MACs per cycle
- Future proof architecture that supports the most advanced ML data types and operators
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Future-proof IP for training and inference with leading performance per watt and per dollar
- RISC-V-based AI IP development for enhanced training and inference.
- Silicon-proven solutions tailored for AI workload optimization.
- Energy-efficient performance with industry-leading Perf/W.
MIPI IP View All
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MIPI C-PHY/D-PHY Combo CSI-2 RX+ IP (6.0Gsps/trio, 4.5Gbps/lane) in TSMC N6
- Dual mode PHY Supports MIPI Alliance Specification D-PHY v2.5 & C-PHY v2.0
- Consists of 1 Clock lane and 4 Data lanes in D-PHY mode
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MIPI CSI-2 controller Receiver v 2.1, Compatible with MIPI C-PHY v1.2 & DPHY v2.1.
- Fully compliant to MIPI standard
- Small footprint
- Code validated with Spyglass
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MIPI D-PHY IP for TSMC (5nm, 6/7nm, 12/16nm, 22nm, 28nm, 40nm)
- Compliant to MIPI Alliance Standard for D-PHY specification Version 2.1, 1.2, 1.1
- Supports standard PHY transceiver compliant to MIPI Specification
- Supports standard PPI interface compliant to MIPI Specification
- Supports synchronous transfer at high speed mode with a bit rate of 80-2500 Mb/s
RISC-V IP View All
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32b/64b RISC-V 5-stage, scalar, in-order, Application Processor. Linux and multi-core capable. Maps upto ARM A-35. Optimal PPA.
- 32/64 Bit RISC-V core
- 5-stage pipeline
- In-order, Single issue
- Multicore Capable (up to 8 cores)
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Dual-issue Linux-capable RISC-V core
- 64-bit RISC-V core
- RVA22 profile
- Linux capable
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High-performance RISC-V CPU
- Fully compliant with the RVA23 RISC-V specification
- Comparable PPA to Arm Neoverse V3 / Cortex-X4
- Standard AMBA CHI.E coherent interface for SoC and chiplet integration
- Co-architected with Veyron E2 for seamless vector, AI acceleration, and big-little style heterogeneous compute configurations