Chiplet and D2D IP
Chiplet and D2D (Die-to-Die) IP cores enable the integration of multiple chips or dies into a single system for improved performance, scalability, and efficiency. These IP cores facilitate seamless communication between individual chips, optimizing interconnects and reducing latency. Bunch of Wires IP ensures high-bandwidth, reliable connections between chips, while UCIe IP (Universal Chiplet Interconnect Express) provides a standardized interface for connecting chiplets, enabling flexible and modular chip designs. Additionally, Ultralink IP offers high-speed, low-latency communication for die-to-die interfaces, ensuring efficient data transfer across multiple processing units.
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Chiplet and D2D IP
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Chiplet and D2D IP
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Intra-Panel TX PHY - 28nm, 14nm, 8nm
- The Intra-panel TX PHY IP is an advanced chip-on-glass (ACOG) and chip-on-film (COF) transmitter embedded into the timing controller for TFT-LCD panels.
- This technology enables a single chip to support multiple display interfaces, reducing system costs and complexity.
- It also provides higher data transfer rates, lower power consumption, and compatibility with a wide range of devices.
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Simulation VIP for UCIE
- Protocol Layer Features
- Streaming mode
- PCIe mode
- Protocol FDI LSMs
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TSMC CLN5FF GUCIe LP Die-to-Die PHY
- IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face advanced package.
- This GUCIe PHY not only supports UCIe specification rev 1.1 compliance physical layer and Raw D2D interface (RDI) but also optionally provides the
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UCIe Controller baseline for Streaming Protocols for ASIL B Compliant, AEC-Q100 Grade 2
- UCIe Controller baseline for Streaming Protocols for ASIL B Compliant, AEC-Q100 Grade 2
- Low latency controller for UCIe-based multi-die designs
- Includes Die-to-Die Adapter layer and Protocol layer
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UCIe Controller add-on CXL3 Protocol Layer
- UCIe Controller add-on CXL3 Protocol Layer
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UCIe Controller add-on CXL2 Protocol Layer
- UCIe Controller add-on CXL2 Protocol Layer
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UCIe Controller baseline for Streaming Protocols
- Low latency controller for UCIe-based multi-die designs
- Includes Die-to-Die Adapter layer and Protocol layer
- Supports on-chip interconnect fabrics including AXI, CHI C2C, CXS, PCIe, CXL, and streaming
- Error detection and correction with optional CRC and retry functionality
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UCIe 2.0 Verification IP
- Available in native SystemVerilog (UVM/OVM /VMM) and Verilog.
- Unique development methodology to ensure highest levels of quality.
- Availability of various Regression Test Suites.
- 24X5 customer support.
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UCIe Verification IP
- Available in native SystemVerilog (UVM/OVM /VMM) and Verilog.
- Unique development methodology to ensure highest levels of quality.
- Availability of various Regression Test Suites.
- 24X5 customer support.
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Verification IP for UCIe
- Avery UCIe VIP provides a comprehensive verification solution featuring an advanced UVM environment that incorporates constrained random traffic gener ation, robust D2D and LogPHY layer controls and error injection, protocol checks and coverage, functional coverage, protocol analyzer-like features for debug ging, and performance analysis metrics.
- PCIe/CXL VIP supports FDI/RDI adapters for complete stack verification. With the advanced capabilities of Avery VIP, engineers can work more efficiently, develop more complex tests, and work on more complex topologies, such as bifurcation.
