Chiplet and D2D IP
Chiplet and D2D (Die-to-Die) IP cores enable the integration of multiple chips or dies into a single system for improved performance, scalability, and efficiency. These IP cores facilitate seamless communication between individual chips, optimizing interconnects and reducing latency. Bunch of Wires IP ensures high-bandwidth, reliable connections between chips, while UCIe IP (Universal Chiplet Interconnect Express) provides a standardized interface for connecting chiplets, enabling flexible and modular chip designs. Additionally, Ultralink IP offers high-speed, low-latency communication for die-to-die interfaces, ensuring efficient data transfer across multiple processing units.
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Chiplet and D2D IP
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Chiplet and D2D IP
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UCIe Chiplet PHY & Controller
- Compliant with the UCIe specification (2.0 & 1.1)
- Flexible Structure, easy to customize (Pre-hardened PHY tuned to Customer Spec, PHY + Adapter Layer, PHY + Adapter Layer + Customized Protocol Layer)
- Supports the CXS/AXI using the streaming package (AXI Interface bandwidth up to 89%)
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<4Gbps Low Power D2D Interface in TSMC 16nm & 28nm
- A <4Gbps, Wide I/O Compatible, Die to Die Interface in TSMC 16nm and 28nm.
- This silicon proven die to die interface includes IP in both TSMC 16nm FFC/FFC+ and 28nm HPM/HPC/HPC+.
- The I/O cells for both versions of the library are defined as TX only and RX only.
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Low Power D2D Interface in TSMC 16nm FFC/FFC+
- This library is a production-quality, silicon-proven custom Die-to-Die high speed interface available in TSMC’s 16nm process.
- The I/O cell is bidirectional, has two modes of operation: standard full rail to rail swing, or a custom low noise pseudo-differential interface.
- The RX cells have a weak pull-down feature.
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Universal Chiplet Interconnect Express(UCIe) VIP
- The UCIe VIP , a state-of-the-art solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of your UCIe designs
- The UCIe VIP is fully compliant with UCIe Specification version 1.0 and supports all the layers of the UCIe stack, such as FDI, RDI, LogPHY, PCIe, and CXL protocols
- The UCIe VIP is also very user-friendly and flexible, with simple APIs, easy integrations, and configurable parameters
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The UCIe CONTROLLER IP
- The UCIe IP solution includes D2D Adapter layer which supports streaming/PCIe/CXL/Raw flitformats, supports both standard and advanced mainband links and sideband links
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UCLe - Ensures reliable validation and efficient connectivity for chiplets
- UCIe VIP is a state-of-the-art solution for validating and ensuring compliance in multi-chip semiconductor systems. With features like high-speed data transfer, protocol compliance, and advanced debugging, it guarantees robust and efficient chiplet communication.
- This technology powers diverse applications, including HPC, AI/ML, automotive electronics, and telecommunications. It ensures seamless data flow, reliability, and energy efficiency across industries like edge computing, cloud platforms, and consumer electronics
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UCIe D2D Adapter
- The D2D Adapter for UCIe is a scalable adapter layer between one or more protocol components and the UCIe PHY, which ensures efficient data transfer across the UCIe Link by seamlessly coordinating with the Protocol Layer and Physical Layer.
- By minimizing logic on the main data path, it delivers a low-latency, optimized pathway for protocol Flits.
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Simulation VIP for UCIE
- Protocol Layer Features
- Streaming mode
- PCIe mode
- Protocol FDI LSMs
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UCIe Verification IP
- Available in native SystemVerilog (UVM/OVM /VMM) and Verilog.
- Unique development methodology to ensure highest levels of quality.
- Availability of various Regression Test Suites.
- 24X5 customer support.
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UCIe 2.0 Verification IP
- Available in native SystemVerilog (UVM/OVM /VMM) and Verilog.
- Unique development methodology to ensure highest levels of quality.
- Availability of various Regression Test Suites.
- 24X5 customer support.