The Pulse
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GUC 业界领先的 TSMC SoIC-X 专用 UCIe Face-up IP 完成投片
2025-07-21T08:23:00+00:00
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新思科技完成对Ansys的收购
2025-07-17T13:13:00+00:00
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新思科技赋能三星先进工艺,加速AI和Multi-Die设计创新
2025-07-15T11:22:00+00:00
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新思科技收购Ansys交易已获全部所需批准
2025-07-15T01:22:00+00:00
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芯动科技独家推出28nm/22nm LPDDR5/4 IP,为客户供应链安全保驾护航
2025-07-14T12:14:00+00:00
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思尔芯超大容量S8-100,简化并加速开芯院香山昆明湖16核RISC-V+NOC验证
2025-07-14T06:07:00+00:00
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SiPearl:完成由台湾 Cathay Venture、EIC Fund 和 France 2030 共同参与的 1.3 亿欧元 A 轮融资
2025-07-09T13:08:00+00:00
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力旺電子旗下熵碼科技之後量子密碼學演算法通過美國 NIST CAVP 認證,PUFpqc 架構正式啟動全球量子安全新時代
2025-07-08T07:07:00+00:00
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新思科技和 Ansys 就收购完成的预计时间发布更新
2025-07-07T06:10:00+00:00
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下一代车规级IP核: 车载通信网络的演进与未来架构
2025-07-02T11:45:00+00:00
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新思科技PCIe 6.x与博通PEX90000系列交换机于PCI-SIG DevCon 2025实现互操作性里程碑
2025-07-01T11:20:00+00:00
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晟联科受邀出席台积电技术研讨会,高速接口IP组合及解决方案助推海量数据畅行
2025-07-01T08:04:00+00:00
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瑞芯微 RK2118 集成 Cadence Tensilica HiFi 4 DSP 提供强大的音频处理
2025-06-30T12:24:00+00:00
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芯来NA900汽车电子客户矽力杰与普华达成战略合作
2025-06-30T11:36:00+00:00
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力旺NeoFuse於台積電N3P製程完成可靠度驗證,為先進AI與HPC晶片提供安全記憶體支援
2025-06-26T06:26:00+00:00
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芯原推出经市场验证的ZSP5000视觉核心系列,扩展其面向边缘智能的数字信号处理器IP组合
2025-06-26T05:28:00+00:00
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芯动科技荣获2025中国半导体市场最具影响力企业奖
2025-06-25T11:52:00+00:00
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芯来科技发布UX1030H,全面支持RVA23
2025-06-24T11:43:00+00:00
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智原推出最新SerDes IP持续布局联电22纳米IP解决方案
2025-06-24T08:36:00+00:00
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Arteris推出全新Magillem Packaging解决方案应对IP模块与芯粒的硅设计复用挑战
2025-06-23T15:40:00+00:00
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Enkl Sound 利用 Tensilica HiFi DSP 优化音频技术,缔造无与伦比的卓越音质
2025-06-23T12:04:00+00:00
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SmartDV推出先进的H.264和H.265视频编码器和解码器IP
2025-06-23T07:19:00+00:00
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Cadence UCIe IP 在 Samsung Foundry 的 5nm 汽车工艺上实现流片成功
2025-06-19T18:47:00+00:00
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Arteris 推出升级版 Multi-Die 解决方案,加速 AI 驱动芯片创新
2025-06-17T18:13:00+00:00
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新思科技携手英特尔共同推动基于18A和18A-P工艺的埃米级芯片设计
2025-06-17T08:43:00+00:00
The Semiconductor IP Marketplace that puts you first
Semi IP Hub's mission is to provide you with a platform where you can find Silicon IP cores for your next project without being harassed by dozens of sellers.
Here, your contact details are not shared with third parties unless you request to be contacted by a supplier.
Spotlight
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1.8V Capable GPIO on Samsung Foundry 4nm FinFET
- The 1.8V capable GPIO is an IP macro for on-chip integration. It is a 1.8V general purpose I/O built with a stack of 1.2V MOS FINFET devices. It is controlled by 0.75V (core) signals.
- Supported features include core isolation, output enable and pull enable. Extra features such as input enable/disable, programmable drive strength and pull select, can be supported upon request.
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Bluetooth Low Energy 6.0 Scalable RF IP
- The SB1001 Scalable RF Transceiver IP is designed to maximise performance per μW across the full range of BLE applications, enabling receiver power consumption as low as 3mW for medical devices, whilst delivering up to +10dBm transmit power when needed for industrial applications.
- It is optimised for applications such as BLE, 802.15.4 (Zigbee, Matter) and proprietary standards operating at 2.4GHz.
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All Digital Fractional-N RF Frequency Synthesizer PLL in GlobalFoundries 22FDX
- Ultra-low jitter, less than 300fs RMS integrated between 12kHz to 20MHz.
- Suitable for many RF applications, including LO, clocks for, ADC, DAC, high-speed PHY
- Small die area (< 0.05 sq mm), using a LC tank oscillator
- Output frequency can be from 1 to 2047 times the input reference, up to 8GHz
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USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- Supports 40 Gbps, 20 Gbps, 10 Gbps, and 5 Gbps data rates
- Supports 480 Mbps, 12 Mbps, and 1.5 Mbps data rates
- x1 and x2 configurations (USB 3.2 and USB 3.1 PHY only)
- Low active and standby power
- Small area for low silicon cost
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TSMC CLN5FF GUCIe LP Die-to-Die PHY
- IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face advanced package.
- This GUCIe PHY not only supports UCIe specification rev 1.1 compliance physical layer and Raw D2D interface (RDI) but also optionally provides the
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Ultra Ethernet Verification IP
- The Ultra Ethernet (UE) Verification IP provides an effective & efficient way to verify the components interfacing with Ethernet interface of an IP or SoC.
- The UE VIP is compliant with IEEE standard 802.3-2018 & UE Specifications V1.0.
- This VIP is light weight with easy plug-and-play interface so that there is no hit on the design cycle time.
UCIe Controller IP View All
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UCIe Die-to-Die Chiplet Controller
- High configurability and customizability
- Defines packets to communicate with a link partner using different AXI parameters
- Supports raw streaming modes
- Provides various Flit formats in UCIe v1.1 (filt format 2: 68B flit format, flit format 3/4: standard 256B flit format, and flit format 5/6: latency optimized 256B flit format)
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UCIe PHY & D2D Adapter
- 32Gbps UCIe-Advanced (UCIe-A) & Standard (UCIe-S)
- UCIe v1.1 specification
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UCIe Die-to-Die PHY
- High Bandwidth Density and Data Rates
- Package Configurability
- Energy Efficiency
- Fully Integrated Solution
PCIe 7.0 IP View All
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PCIe 7.0 Controller with AXI
- Optimized for high-bandwidth efficiency at data rates up to 128 GT/s
- Separate native TX/RX data path separating posted/Non posted/completion traffic
- Handles up to 4 TLPs per cycle
- Advanced PIPE modes and port bifurcation
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PCIe 7.0 PHY IP
- Physical Coding Sublayer (PCS) block with PIPE interface
- Supports PCIe 7.0, encoding, backchannel initialization
- Lane margining at the receiver
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PCIe 7.0 PHY in TSMC (N5, N3P)
- Physical Coding Sublayer (PCS) block with PIPE interface
- Supports PCIe 7.0, encoding, backchannel initialization
- Lane margining at the receiver
- Spread-spectrum clocking (SSC)
AI IP View All
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RISC-V CPU IP
- RISC-V RVA23 Compliant
- >18 SPECint2006/GHz
- 8-wide decode unit
- Advanced branch predictor
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NPU IP for Embedded ML
- Fully programmable to efficiently execute Neural Networks, feature extraction, signal processing, audio and control code
- Scalable performance by design to meet wide range of use cases with MAC configurations with up to 64 int8 (native 128 of 4x8) MACs per cycle
- Future proof architecture that supports the most advanced ML data types and operators
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Future-proof IP for training and inference with leading performance per watt and per dollar
- RISC-V-based AI IP development for enhanced training and inference.
- Silicon-proven solutions tailored for AI workload optimization.
- Energy-efficient performance with industry-leading Perf/W.
MIPI IP View All
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MIPI C-PHY/D-PHY Combo CSI-2 RX+ IP (6.0Gsps/trio, 4.5Gbps/lane) in TSMC N6
- Dual mode PHY Supports MIPI Alliance Specification D-PHY v2.5 & C-PHY v2.0
- Consists of 1 Clock lane and 4 Data lanes in D-PHY mode
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MIPI CSI-2 controller Receiver v 2.1, Compatible with MIPI C-PHY v1.2 & DPHY v2.1.
- Fully compliant to MIPI standard
- Small footprint
- Code validated with Spyglass
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MIPI D-PHY IP for TSMC (5nm, 6/7nm, 12/16nm, 22nm, 28nm, 40nm)
- Compliant to MIPI Alliance Standard for D-PHY specification Version 2.1, 1.2, 1.1
- Supports standard PHY transceiver compliant to MIPI Specification
- Supports standard PPI interface compliant to MIPI Specification
- Supports synchronous transfer at high speed mode with a bit rate of 80-2500 Mb/s
RISC-V IP View All
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32b/64b RISC-V 5-stage, scalar, in-order, Application Processor. Linux and multi-core capable. Maps upto ARM A-35. Optimal PPA.
- 32/64 Bit RISC-V core
- 5-stage pipeline
- In-order, Single issue
- Multicore Capable (up to 8 cores)
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Dual-issue Linux-capable RISC-V core
- 64-bit RISC-V core
- RVA22 profile
- Linux capable
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High-performance RISC-V CPU
- Fully compliant with the RVA23 RISC-V specification
- Comparable PPA to Arm Neoverse V3 / Cortex-X4
- Standard AMBA CHI.E coherent interface for SoC and chiplet integration
- Co-architected with Veyron E2 for seamless vector, AI acceleration, and big-little style heterogeneous compute configurations