The Semiconductor IP Marketplace

Spotlight

• UCIe PHY (Die-to-Die) IP

  • Compliant with UCIe v2.0, supporting 4/8/12/16/24/32GT/s data rates
  • for Standard Package up to 16 lanes / for Advanced Package up to 64 lanes
  • Provides a 1024-bit data bus width with high-throughput die-to-die communication
  • Includes automatic per-lane calibration and optional transmitter de-emphasis
  
• Simulation VIP for LPDDR6

  • This Verification IP (VIP) is intended for modeling the upcoming JEDEC Low-Power Memory Device, LPDDR6 design specification.
  • It provides a mature, highly capable compliance verification solution that supports simulation, formal analysis, and hardware acceleration platforms, making it applicable to intellectual property (IP), system-on-chip (SoC), and system-level verification.
  
• UCIe-S 64GT/s PHY IP

  • The UCIe-S 64GT/s PHY IP is a cutting-edge solution designed to meet the growing demand for ultra-high-speed interconnects between dies in standard packaging environments.
  • Leveraging the UCIe (Universal Chiplet Interconnect Express) 3.0 standard, this IP supports a blistering data rate of up to 64Gbps per lane, enabling next-generation AI, HPC, and data center SoC applications.
• UA Link DL IP core

  • The UA Link DL IP Core is a high-performance, silicon-agnostic and fully compliant Data Layer implementation of UALink_200 specifi cation.
  • Designed for seamless integration into accelerator, switch, and SoC designs, it delivers deterministic low-latency, robust error correction, and compatibility with multiple high-speed Ethernet-derived link rates.
  
• 10-bit Pipeline ADC - Tower 180 nm

  • 10-bit resolution
  • 25 MSPS sampling rate
  • 6 mW power
  • 25 MHz Input Bandwidth
• NoC Verification IP

  • Complex network with acyclic agent graph (DAG). Layered and parallel NOC is also supported.
  • Any number of master and slave ports is supported. Each port can be configured individually.
  • ARM® AHB3-Lite,5, ARM® AXI 3,4,4-Lite,5,5-Lite, ARM® APB 2,3,4,5, SiFive TileLink Tl-UL, Tl-UH, TL-C.
  

UCIe Controller IP View All

• UCIe Die-to-Die Chiplet Controller

  • High configurability and customizability
  • Defines packets to communicate with a link partner using different AXI parameters
  • Supports raw streaming modes
  • Provides various Flit formats in UCIe v1.1 (filt format 2: 68B flit format, flit format 3/4: standard 256B flit format, and flit format 5/6: latency optimized 256B flit format)
  
• UCIe PHY & D2D Adapter

  • 32Gbps UCIe-Advanced (UCIe-A) & Standard (UCIe-S)
  • UCIe v1.1 specification
  
• TSMC CLN5FF GUCIe LP Die-to-Die PHY

  • IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face advanced package.
  • This GUCIe PHY not only supports UCIe specification rev 1.1 compliance physical layer and Raw D2D interface (RDI) but also optionally provides the
  

PCIe 7.0 IP View All

• PCIe 7.0 Controller with AXI

  • Optimized for high-bandwidth efficiency at data rates up to 128 GT/s
  • Separate native TX/RX data path separating posted/Non posted/completion traffic
  • Handles up to 4 TLPs per cycle
  • Advanced PIPE modes and port bifurcation
  
• PCIe 7.0 PHY IP

  • Physical Coding Sublayer (PCS) block with PIPE interface
  • Supports PCIe 7.0, encoding, backchannel initialization
  • Lane margining at the receiver
• PCIe 7.0 PHY in TSMC (N5, N3P)

  • Physical Coding Sublayer (PCS) block with PIPE interface
  • Supports PCIe 7.0, encoding, backchannel initialization
  • Lane margining at the receiver
  • Spread-spectrum clocking (SSC)

AI IP View All

• RISC-V CPU IP

  • RISC-V RVA23 Compliant 
  • >18 SPECint2006/GHz
  • 8-wide decode unit
  • Advanced branch predictor
  
• NPU IP for Embedded ML

  • Fully programmable to efficiently execute Neural Networks, feature extraction, signal processing, audio and control code
  • Scalable performance by design to meet wide range of use cases with MAC configurations with up to 64 int8 (native 128 of 4x8) MACs per cycle
  • Future proof architecture that supports the most advanced ML data types and operators
  
• Future-proof IP for training and inference with leading performance per watt and per dollar

  • RISC-V-based AI IP development for enhanced training and inference.
  • Silicon-proven solutions tailored for AI workload optimization.
  • Energy-efficient performance with industry-leading Perf/W.
  

MIPI IP View All

• MIPI C-PHY/D-PHY Combo CSI-2 RX+ IP (6.0Gsps/trio, 4.5Gbps/lane) in TSMC N6

  • Dual mode PHY Supports MIPI Alliance Specification D-PHY v2.5 & C-PHY v2.0
  • Consists of 1 Clock lane and 4 Data lanes in D-PHY mode
  
• MIPI CSI-2 controller Receiver v 2.1, Compatible with MIPI C-PHY v1.2 & DPHY v2.1.

  • Fully compliant to MIPI standard
  • Small footprint
  • Code validated with Spyglass
  
• MIPI D-PHY IP for TSMC (5nm, 6/7nm, 12/16nm, 22nm, 28nm, 40nm)

  • Compliant to MIPI Alliance Standard for D-PHY specification Version 2.1, 1.2, 1.1
  • Supports standard PHY transceiver compliant to MIPI Specification
  • Supports standard PPI interface compliant to MIPI Specification
  • Supports synchronous transfer at high speed mode with a bit rate of 80-2500 Mb/s
  

RISC-V IP View All

• 32b/64b RISC-V 5-stage, scalar, in-order, Application Processor. Linux and multi-core capable. Maps upto ARM A-35. Optimal PPA.

  • 32/64 Bit RISC-V core
  • 5-stage pipeline
  • In-order, Single issue
  • Multicore Capable (up to 8 cores)
  
• Dual-issue Linux-capable RISC-V core

  • 64-bit RISC-V core
  • RVA22 profile
  • Linux capable
  
• High-performance RISC-V CPU

  • Fully compliant with the RVA23 RISC-V specification
  • Comparable PPA to Arm Neoverse V3 / Cortex-X4
  • Standard AMBA CHI.E coherent interface for SoC and chiplet integration
  • Co-architected with Veyron E2 for seamless vector, AI acceleration, and big-little style heterogeneous compute configurations