Redefining XPU Memory for AI Data Centers Through Custom HBM4 – Part 3
Part 3: implementing custom HBM
This is the third and final of a series from Alphawave Semi on HBM4 and gives and examines custom HBM implementations. Click here for part 1, which gives an overview of the HBM standard, and here for part 2, on HBM implementation challenges.
This follows on from our second blog, where we discussed the substantial improvements high bandwidth memory (HBM) provides over traditional memory technologies for high-performance applications, and in particular AI training, deep learning, and scientific simulations. In this, we detailed the various advanced design techniques implemented during the pre-silicon design phase. We also highlighted the critical need for more innovative memory solutions to keep pace with the data revolution as AI has pushed the boundaries of what computational systems can do. A custom implementation of HBM allows for greater integration with compute dies and custom logic and can, therefore, be a performance differentiator justifying its complexity.
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Related Semiconductor IP
- TSMC CLN3FFP HBM4 PHY
- HBM4 Memory Controller
- HBM4E PHY and controller
- HBM4/3E Combo PHY & Controller
Related Blogs
- Redefining XPU Memory for AI Data Centers Through Custom HBM4 – Part 1
- Redefining XPU Memory for AI Data Centers Through Custom HBM4 – Part 2
- PAM4 and Coherent-lite Interconnect for Hyperscale Campuses and AI Data Centers
- Part 3: High-Bandwidth Accelerator Access to Memory: Enabling Optimized Data Transfers with RISC-V
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