How to Achieve Faster Signoff of Billion-Gate, Low-Power SoCs
April 6, 2023
Semi IP Hub Industry Expert Blogs
4 Critical Characteristics for Automotive SoCs
April 5, 2023
Raising RISC-V processor quality with formal verification
April 4, 2023
Arm looking to charge phone-makers
April 3, 2023
An Industry-Wide Look at the Move Toward Multi-Die Systems
April 3, 2023
The Five Must-Have Features of Modern Automotive SoC Architectures
April 3, 2023
RISC-V-Based ASSP EASY for Voice HMI - The Journey Continues
March 30, 2023
AI Is Driving a New Frontier in Chip Design
March 30, 2023
NVMe® 2.0 Specifications: Enabling Efficient Boot Over NVMe Transports
March 27, 2023
Winning Embedded World Best in Show for RISC-V Functional Safety Processor
March 27, 2023
Why AI Requires a New Chip Architecture
March 24, 2023
How AI Drives Faster Chip Verification Coverage and Debug for First-Time-Right Silicon
March 23, 2023
Enhancing Audio Quality with Environmental Noise Cancellation in Sound Processing - Part 1 - Introduction
March 23, 2023
Unleashing the Potential of RISC-V: A Recap of the SiFive Tech Forum
March 23, 2023
How Synopsys and NVIDIA Are Accelerating Semiconductor Scaling in the AI Age
March 22, 2023
Embedded World 2023: it's time to architect all ambitions with custom compute
March 21, 2023
Imagination at GDC 2023: Quaternions, multi-core, ray tracing and more
March 21, 2023
Secure DDR DRAM Against Rowhammer, RAMBleed, and Cold-Boot Attacks
March 21, 2023
Synopsys Accelerates Multi-Die System Designs With Successful UCIe PHY IP Tape-Out on TSMC N3E Process
March 20, 2023
How AI Will Change Chip Design
March 17, 2023