Moving AMBA forward with multi-chip and CHI C2C
May 2, 2023
AMBA has a long history of collaborating with the ecosystem to solve complex and industry-wide problems. Now, as the industry embraces chiplets, is the time to extend AMBA from on-chip to multi-chip.
In this blog, we outline AMBA’s approach with CHI C2C – an extension to on-chip CHI that is being developed to make CHI suitable for connecting chip(let)-to-chip(let).
We also illustrate how AMBA CHI C2C will complement chiplet standardization efforts like UCIe, with a view to drive further alignment and collaboration.
Why chiplets and why now?
Related Semiconductor IP
- CXL 3.0 Premium Controller EP/RP/DM/SW 128-1024 bits with AMBA bridge and Advanced HPC Features (Arm CCA)
- CXL 3.0 Premium Controller EP/RP/DM 1024b/512b/256b/128b with AMBA bridge for CXL.io and LTI & MSI Interfaces
- CXL 3.0 Premium Controller EP/RP/DM 1024b/512b/256b/128b with AMBA bridge for CXL.io
- CXL 2.0 Premium Controller Device/Host/DM 512b with AMBA bridge and Advanced HPC Features (Arm CCA)
- CXL 2.0 Premium Controller Device/Host/DM 512b with AMBA bridge + LTI and MSI-GIC interfaces
Related Blogs
- AMBA moves forward with major revisions to AXI and CHI specifications
- Synopsys AMBA CHI C2C System Verification Solutions
- Synopsys and Alchip Collaborate to Streamline the Path to Multi-die Success with Soft Chiplets
- Reducing Manual Effort and Achieving Better Chip Verification Coverage with AI and Formal Techniques
Latest Blogs
- Why Choose Hard IP for Embedded FPGA in Aerospace and Defense Applications
- Migrating the CPU IP Development from MIPS to RISC-V Instruction Set Architecture
- Quintauris: Accelerating RISC-V Innovation for next-gen Hardware
- Say Goodbye to Limits and Hello to Freedom of Scalability in the MIPS P8700
- Why is Hard IP a Better Solution for Embedded FPGA (eFPGA) Technology?