Electrical Validation of DDR4 Interfaces
August 12, 2015
Developing SoCs with high-speed memory interfaces, such as DDR4, presents substantial challenges throughout the design process. Today’s high-performance semiconductor processes enable high-speed design, and require expertise in signal integrity design, timing closure, and system bring-up. One of the biggest challenges is co-designing the memory interface, the chip package, and the PCB to preserve the high-speed signal integrity.
To read the full article, click here
Related Semiconductor IP
- DDR3 and DDR4 Controller and PHY on TSMC 12nm
- Universal Multi-port Memory Controller for RLDRAM2/3, DDR5/4/3, DDR4 3DS and LPDDR3/2 and LPDDR3/2
- Universal Multi-port Memory Controller for RLDRAM2/3, DDR4/3, DDR4 3DS and LPDDR3/2 and LPDDR3/2
- DDR4 Controller
- DDR4 Controller - Validates memory compliance, optimizes performance, ensures reliability
Related Blogs
- The Advancements of DDR5: How it Stacks Up Against DDR4
- Trillions of Cycles per Day: How SiFive Boosts IP and Software Validation with Synopsys HAPS Prototyping System
- SSD Interfaces and Performance Effects
- DDR4 Controller IP, Cadence IP strategy... and Synopsys
Latest Blogs
- MIPS P8700 RISC-V Processor for Advanced Functional Safety Systems
- Boost SoC Flexibility: 4 Design Tips for Memory Subsystems with Combo DDR3/4 Interfaces
- High Bandwidth Memory Evolution from First Generation HBM to the Latest HBM4
- Keeping Pace with CXL Specification Revisions
- Silicon-proven LVTS for 2nm: a new era of accuracy and integration in thermal monitoring