Electrical Validation of DDR4 Interfaces
August 12, 2015
Developing SoCs with high-speed memory interfaces, such as DDR4, presents substantial challenges throughout the design process. Today’s high-performance semiconductor processes enable high-speed design, and require expertise in signal integrity design, timing closure, and system bring-up. One of the biggest challenges is co-designing the memory interface, the chip package, and the PCB to preserve the high-speed signal integrity.
To read the full article, click here
Related Semiconductor IP
- Universal Multi-port Memory Controller for RLDRAM2/3, DDR5/4/3, DDR4 3DS and LPDDR3/2 and LPDDR3/2
- Universal Multi-port Memory Controller for RLDRAM2/3, DDR4/3, DDR4 3DS and LPDDR3/2 and LPDDR3/2
- DDR4 Controller
- DDR4 Controller - Validates memory compliance, optimizes performance, ensures reliability
- DDR4 IP solution
Related Blogs
- The Advancements of DDR5: How it Stacks Up Against DDR4
- Trillions of Cycles per Day: How SiFive Boosts IP and Software Validation with Synopsys HAPS Prototyping System
- SSD Interfaces and Performance Effects
- DDR4 Controller IP, Cadence IP strategy... and Synopsys
Latest Blogs
- Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
- The Role of GPU in AI: Tech Impact & Imagination Technologies
- Time-of-Flight Decoding with Tensilica Vision DSPs - AI's Role in ToF Decoding
- Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles
- Deep Robotics and Arm Power the Future of Autonomous Mobility