Electrical Validation of DDR4 Interfaces
August 12, 2015
Developing SoCs with high-speed memory interfaces, such as DDR4, presents substantial challenges throughout the design process. Today’s high-performance semiconductor processes enable high-speed design, and require expertise in signal integrity design, timing closure, and system bring-up. One of the biggest challenges is co-designing the memory interface, the chip package, and the PCB to preserve the high-speed signal integrity.
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