Building a robust HBM2 PHY
What is HBM?
HBM is a high-performance memory that features reduced power consumption and a small form factor. More specifically, it combines 2.5D packaging with a wider interface at a lower clock speed (as compared to DDR4) to deliver higher overall throughput at a higher bandwidth-per-watt efficiency for high-performance computing applications.
To read the full article, click here
Related Semiconductor IP
Related Blogs
- Rambus highlights HBM2 PHY collaboration at GLOBALFOUNDRIES Technology Conference
- UCIe Heralds a Robust Chiplet Ecosystem for a New Era of SoC Innovation
- Need to develop robust Indian semicon industry, led by local companies!
- How many people does it take to design an SoC? - Redux. Building brains with processors.
Latest Blogs
- MIPI: Powering the Future of Connected Devices
- ESD Protection for an High Voltage Tolerant Driver Circuit in 4nm FinFET Technology
- Designing the AI Factories: Unlocking Innovation with Intelligent IP
- Smarter SoC Design for Agile Teams and Tight Deadlines
- Automotive Reckoning: Industry Leaders Discuss the Race to Redefine Car Development