HBM3 PHY & Controller

Overview

SkyeChip’s High Bandwidth Memory (HBM) IP consists of a PHY and memory controller optimized for TSMC N7, N12 and Samsung 4nm process to support the HBM3 memory standard operating at up to 6.4 Gbps/pin. SkyeChip’s HBM IP is designed for high memory throughput and low latency applications while minimizing area and power consumption.

SkyeChip’s HBM IP is available either as a standalone HBM3 PHY that communicates with a memory controller over a modified variant of the DDR PHY Interface (DFI) 5.0 standard or as a combination of both the HBM3 PHY and the HBM3 memory controller as shown in Figure 1. The HBM3 PHY is provided as a hard HBM3 PHY IP that is primarily delivered as GDSII inclusive of its own PLL and the HBM3 I/Os. The HBM3 PHY is also equipped with a hardware-assisted embedded microcontroller that is responsible to train and optimize the channel timings of the memory interface. The hardware-assisted embedded microcontroller provides the flexibility to perform firmware-based training algorithms and interface tests.

Key Features

  • Mainband to initiate reads and writes to the memory – multi-port per pseudo channel capability available via NoC add-on block
  • Sideband for exception, error handling and firmware delivery
  • Interface to the HBM3 PHY
  • Flexibility to customize the mapping of the host memory map
  • Support for 4H, 8H, 12H and 16H die stacks
  • Support for out-of-order scheduling for best memory bus efficiency with configurable paging policies and priority scheduling
  • Anti-starvation scheme to ensure QoS is met
  • Support for partial writes included
  • Native support for basic RAS features like command parity, ECS, RFM, ECC (SEC-DED), data scrambling and temperature-compensated refresh – enhanced RAS engine available as an add-on core
  • Support for system-controlled or auto self-refresh, power-down and refresh handling, pulled-in or postponed refreshes and throttling and trips due to thermal events
  • Support memory BIST for DRAM and internal SRAM and scan
  • Support for NoC add-on block and RAS and debug (observation, logical loopback, traffic generator/checker) engines

Benefits

  • One stop PHY & Controller solution with an average random efficiency of more than 85%
  • Supports up to 6400 MT/s
  • DFI 5.0 compatible interface to the memory controller
  • Flexible PHY with programmable intelligent interface training sequences
  • Flexible IEEE1500 interface to support memory vendor customizations
  • Supports up to 32Gb density per die
  • Supports major 2.5D/3D packaging technologies including support for interposer designs and interconnect and memory repairs
  • Add-on features/engines for MPFE, RAS and Debug available upon request
  • Add-on feature for generic 2.5D die-to-die data transport interconnect

Applications

  • Data center and networking
  • High performance computing (HPC)
  • Artificial intelligence (AI)
  • High-end graphics

Deliverables

  • Executable .run installation file
  • GDSII, LEF Files, LVS netlists, .lib/.db
  • timing models, Verilog model, DRC/LVS log files, I/O IBIS model, I/O HSPICE netlist, parameterized Verilog top-level PHY netlist files
  • sample verification environment, PHY data book
  • physical implementation guide, application notes, verification guide, installation guide, implementation checklist
  • The PHY Utility Block includes Verilog code, synthesis/STA constraints and scripts, sample verification environment, data book

Technical Specifications

Foundry, Node
TSMC N12, N7, SF4
Availability
Now at SkyeChip.com
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Semiconductor IP