AI Requires Tailored DRAM Solutions: Part 4
Frank Ferro, Senior Director Product Management at Rambus, and Shane Rau, Senior Research Executive at IDC, recently hosted a webinar that explores the role of tailored DRAM solutions in advancing artificial intelligence. Part three of this four-part series touched on a wide range of topics including the impact of AI on specific hardware systems, training versus inference, and selecting the most appropriate memory for AI/ML. This blog post (part four) takes a closer look at the evolution of HBM and GDDR6, as well as the design tradeoffs and challenges of the two memory types.
To read the full article, click here
Related Semiconductor IP
Related Blogs
- AI Requires Tailored DRAM Solutions: Part 1
- AI Requires Tailored DRAM Solutions: Part 2
- AI Requires Tailored DRAM Solutions: Part 3
- Intel vs. ARM: In the Smartphone Era (Part 4)
Latest Blogs
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms