AI Requires Tailored DRAM Solutions: Part 2
September 17, 2020
Frank Ferro, Senior Director Product Management at Rambus, and Shane Rau, Senior Research Executive at IDC, recently hosted a webinar that explores the role of tailored DRAM solutions in advancing artificial intelligence. Part one of this four-part series reviewed a range of topics including the interconnected system landscape, the impact of COVID-19 on the data center, and how AI is helping to make sense of the data deluge. This blog (part two), takes a closer look at how AI enables useful data processing, various examples of AI silicon, and the evolving role of DRAM in advancing artificial intelligence.
To read the full article, click here
Related Semiconductor IP
Related Blogs
- AI Requires Tailored DRAM Solutions: Part 1
- AI Requires Tailored DRAM Solutions: Part 3
- AI Requires Tailored DRAM Solutions: Part 4
- Redefining XPU Memory for AI Data Centers Through Custom HBM4 – Part 2
Latest Blogs
- A Comparison on Different AMBA 5 CHI Verification IPs
- Cadence Recognized as TSMC OIP Partner of the Year at 2025 OIP Ecosystem Forum
- Accelerating Development Cycles and Scalable, High-Performance On-Device AI with New Arm Lumex CSS Platform
- Desktop-Quality Ray-Traced Gaming and Intelligent AI Performance on Mobile with New Arm Mali G1-Ultra GPU
- Powering Scale Up and Scale Out with 224G SerDes for UALink and Ultra Ethernet