Comcores is now a member of the OPEN Alliance
2025-03-19 14:54:00
Business
Recent News
FAMES makes its open call for 10nm, 7nm FD-SOI
2025-03-19 11:50:00
Commentary / Analysis
Omni Design Technologies Delivers Multi-Gigahertz SWIFT™ Data Converter Solutions for Satellite Communications
2025-03-19 09:45:00
IP
KiviCore and CAST Release Post-Quantum Cryptographic Key Encapsulation IP Core
2025-03-19 09:39:00
IP
Synopsys Accelerates Chip Design with NVIDIA Grace Blackwell and AI to Speed Electronic Design Automation
2025-03-18 22:29:00
EDA
Arteris Selected by Nextchip to Accelerate Chip Designs for Automotive Vision Technology
2025-03-18 15:10:00
Deals
Sofics and Dolphin Semiconductor Announce Strategic Partnership
2025-03-18 14:25:00
Business
Zero ASIC launches world’s first open standard eFPGA product
2025-03-18 08:57:00
IP
Andes Technology Achieves Record Annual Revenue Amid Strong AI Demand
2025-03-17 16:57:00
Financial
Espressif’s ESP32-C6: the World's First RISC-V MCU to Achieve PSA-L2
2025-03-17 16:42:00
Chip
Global Top 10 IC Design Houses See 49% YoY Growth in 2024, NVIDIA Commands Half the Market, Says TrendForce
2025-03-17 14:35:00
Commentary / Analysis
QuickLogic to Exhibit at GOMACTech 2025, Showcasing the Australis™ eFPGA IP Generator
2025-03-17 09:21:00
Event
ECOBLOX Partners with Tenstorrent to Drive AI/HPC Data Center Growth in the Middle East/Africa Region
2025-03-17 09:15:00
Business
InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications
2025-03-14 10:54:00
Business
Openchip and imec Sign Strategic MoU to Advance AI Technologies
2025-03-14 09:20:00
Research
TSMC and MediaTek Demonstrate First Integrated PMU and PA for Wireless Connectivity Products on N6RF+ Process Technology
2025-03-13 17:19:00
Foundries
Adopters Spotlight AV1’s Transformative Benefits in AOMedia Showcase
2025-03-13 16:52:00
Standard
Credo Files AEC Patent Infringement Complaint Against Amphenol, Molex, TE Connectivity, and Volex with United States International Trade Commission
2025-03-13 15:27:00
Legal
GUC Announces Successful Launch of Industry's First 32G UCIe Silicon on TSMC 3nm and CoWoS Technology
2025-03-13 09:04:00
IP
Intel Appoints Lip-Bu Tan as Chief Executive Officer
2025-03-13 08:35:00
People
FAMES makes its open call for 10nm, 7nm FD-SOI
2025-03-19 11:50:00
Commentary / Analysis
Omni Design Technologies Delivers Multi-Gigahertz SWIFT™ Data Converter Solutions for Satellite Communications
2025-03-19 09:45:00
IP
KiviCore and CAST Release Post-Quantum Cryptographic Key Encapsulation IP Core
2025-03-19 09:39:00
IP
Synopsys Accelerates Chip Design with NVIDIA Grace Blackwell and AI to Speed Electronic Design Automation
2025-03-18 22:29:00
EDA
Arteris Selected by Nextchip to Accelerate Chip Designs for Automotive Vision Technology
2025-03-18 15:10:00
Deals
Sofics and Dolphin Semiconductor Announce Strategic Partnership
2025-03-18 14:25:00
Business
Zero ASIC launches world’s first open standard eFPGA product
2025-03-18 08:57:00
IP
Andes Technology Achieves Record Annual Revenue Amid Strong AI Demand
2025-03-17 16:57:00
Financial
Espressif’s ESP32-C6: the World's First RISC-V MCU to Achieve PSA-L2
2025-03-17 16:42:00
Chip
Global Top 10 IC Design Houses See 49% YoY Growth in 2024, NVIDIA Commands Half the Market, Says TrendForce
2025-03-17 14:35:00
Commentary / Analysis
QuickLogic to Exhibit at GOMACTech 2025, Showcasing the Australis™ eFPGA IP Generator
2025-03-17 09:21:00
Event
ECOBLOX Partners with Tenstorrent to Drive AI/HPC Data Center Growth in the Middle East/Africa Region
2025-03-17 09:15:00
Business
InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications
2025-03-14 10:54:00
Business
Openchip and imec Sign Strategic MoU to Advance AI Technologies
2025-03-14 09:20:00
Research
TSMC and MediaTek Demonstrate First Integrated PMU and PA for Wireless Connectivity Products on N6RF+ Process Technology
2025-03-13 17:19:00
Foundries
Adopters Spotlight AV1’s Transformative Benefits in AOMedia Showcase
2025-03-13 16:52:00
Standard
Credo Files AEC Patent Infringement Complaint Against Amphenol, Molex, TE Connectivity, and Volex with United States International Trade Commission
2025-03-13 15:27:00
Legal
GUC Announces Successful Launch of Industry's First 32G UCIe Silicon on TSMC 3nm and CoWoS Technology
2025-03-13 09:04:00
IP
Intel Appoints Lip-Bu Tan as Chief Executive Officer
2025-03-13 08:35:00
People