DI3CM-HCI, A High-Performance MIPI I3C Host Controller IP Core for Next-Generation Embedded Designs

Bytom, Poland -- December 16, 2025 -- DCD-SEMI, a provider of silicon-proven IP solutions, announces the availability of the DI3CM-HCI, an advanced MIPI I3C Host Controller Interface (HCI) IP Core designed to modernize peripheral connectivity in embedded, IoT, consumer, and industrial systems.

Designed as a drop-in, higher-bandwidth, lower-power alternative to I²C and SPI, the DI3CM-HCI brings robust performance and scalability to designs that depend on increasingly dense arrays of sensors and actuators. The IP fully conforms to MIPI I3C Basic v1.1.1 and demonstrates general compliance with the MIPI I3C HCI Specification 1.1, making it ideal for SoC teams preparing for next-generation architectures.

"We’re seeing a clear shift in the industry toward I3C as the new baseline for intelligent peripheral connectivity," said Tomek Krzyżak, CTO at DCD-SEMI. "The DI3CM-HCI provides the bandwidth, determinism, and power efficiency modern embedded systems require—while keeping integration as simple as possible for engineers."

At up to 12.5 MHz operation, the DI3CM-HCI supports I3C SDR and HDR-DDR modes, while remaining fully backward compatible with I²C. Power efficiency is enhanced through optional clock gating, and throughput is optimized via configurable buffer sizes, programmable DAT/DCT structures, and a DMA handshake interface.

"Our goal was to give designers a controller that doesn’t limit them," added Tomek Krzyżaki, CTO at DCD-SEMI. "Flexible FIFOs, customizable buffer depths, and ready-to-use bus wrappers reduce integration time dramatically—especially for teams working under tight schedules."

Key Features:

• Full compliance with MIPI I3C Basic v1.1.1
• General compliance with MIPI I3C HCI Specification 1.1
• Up to 12.5 MHz clock frequency
• Support for I3C SDR and I3C HDR-DDR modes
• Legacy I²C communication compatibility
• Dynamic Address Assignment (DAA)
• In-Band Interrupts and Hot-Join
• Common Command Codes (CCC)
• Configurable FIFO and memory buffers
• Configurable DAT/DCT (up to 16 slots)
• DMA handshake interface
• Power-efficient design with optional clock gating
• Memory-mapped interface with available wrappers:
  • AMBA APB / AHB / AXI
  • Altera Avalon
  • Xilinx OPB

Engineered for Fast, Low-Risk Integration

To help teams accelerate project timelines, DI3CM-HCI ships with extensive documentation, synthesis scripts, reference implementations, and support options. Ready-to-use bus wrappers enable seamless deployment across FPGA prototypes and ASIC production environments.

"Engineers want solutions that just work," said Krzyżak. "DI3CM-HCI removes the friction of adopting I3C and lets designers focus on building better systems—not fighting the interconnect."

Explore MIPI I3C IP:

• MIPI I3C Basic v1.1.1 specifications with Host Controller Interface v1.1 specification

Target Applications

The DI3CM-HCI is optimized for designs where efficient peripheral communication, low power consumption, and tight latency control are critical. Key application domains include:

 IoT and Edge Devices

Ideal for sensor-rich platforms such as smart home hubs, environmental monitors, wearables, industrial IoT nodes, and battery-powered edge devices. I3C’s lower power profile extends device lifetime while maintaining high data integrity across multiple sensors.

 Consumer Electronics

Suitable for smartphones, tablets, AR/VR headsets, smart appliances, and human–machine interfaces where compact, high-throughput interconnects are essential for responsiveness and user experience.

 Automotive & Transportation Systems

Applicable in ADAS units, driver-monitoring systems, cabin environmental sensing, powertrain controllers, and safety-critical sensor clusters. Backward compatibility with I²C helps OEMs migrate legacy platforms without redesigning entire subsystem chains.

Industrial & Robotics

Supports robotics systems, automation controllers, predictive maintenance sensors, and motor-control applications. The DMA handshake and configurable FIFOs ensure deterministic throughput even in real-time workloads.

Medical & Health Monitoring Equipment

Suited for portable diagnostic devices, multi-sensor monitoring systems, wearable medical electronics, and equipment requiring low-noise, reliable sensor data streaming.

FPGA- and ASIC-Based Prototyping

Thanks to its configurable interface wrappers (AMBA/APB/AHB/AXI, Avalon, OPB), DI3CM-HCI can be integrated into any SoC architecture, speeding up prototype development and reducing system-level risk.

Across all these segments, DI3CM-HCI enables engineers to replace slow, power-heavy legacy buses with a modern, synchronized, feature-rich interface that keeps pace with next-generation embedded system requirements.

More information: www.dcd-semi.com | Contact: info@dcd-semi.com