JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC 2025-04-17 08:40:00 Standard
VeriSilicon Launches Ultra-Low Power OpenGL ES GPU with Hybrid 3D/2.5D Rendering for Wearables 2025-04-16 08:28:00 IP
New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks 2025-04-15 09:03:00 IP
Orthogone Technologies and Blackcore® Technologies Announce Strategic Partnership to Deliver Ultra-Low Latency Solutions for High-Frequency Trading 2025-04-14 18:31:00 Business
Electronic System Design Industry Posts $4.9 Billion in Revenue in Q4 2024, ESD Alliance Reports 2025-04-14 17:02:00 Commentary / Analysis
Doteck Integrates intoPIX JPEG XS for High-Performance ST 2110 8K & 4K Encoding 2025-04-14 15:47:00 Deals
Gartner Says Worldwide Semiconductor Revenue Grew 21% in 2024 2025-04-14 15:24:00 Commentary / Analysis
Omni Design Technologies Offers 3nm, Single Core-voltage Supply Rail Process, Voltage and Temperature (PVT) Monitor 2025-04-14 09:31:00 IP
EnSilica: Ongoing Investment in Space Industry Fuelling Silicon Chip Demand 2025-04-14 09:19:00 Business
Expedera Achieves ISO 9001:2015 Certification for Quality Management Systems 2025-04-11 10:37:00 Business
Defacto Technologies Automates Front-End SoC Integration for Large RISC-V Designs 2025-04-11 10:27:00 EDA