NY CREATES and Fraunhofer Institute Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale 2025-05-16 10:22:00 Research
Flow Reaches Milestone: PPU Achieves End-to-End CPU Operations in Alpha Testing 2025-05-16 07:29:00 IP
Perforce Partners with Siemens for Software-Defined, AI-Powered, Silicon-Enabled Design 2025-05-15 12:25:00 EDA
Geopolitical Tensions Fuel a Wave of AI Chip Independence as US and Chinese CSPs Race to Develop In-House ASICs, Redefining the Market Landscape, Says TrendForce 2025-05-15 10:53:00 Commentary / Analysis
Secafy Licenses Menta's eFPGA IP to Power Chiplet-Based Secure Semiconductor Designs 2025-05-14 12:43:00 Deals
M31 Technology: Strong Momentum in Advanced Nodes as 2nm IP Adoption Accelerates – Steady Growth in H1 2025-05-14 07:51:00 Financial
Arteris Announces Financial Results for the First Quarter and Estimated Second Quarter and Updated Full Year 2025 Guidance 2025-05-14 06:58:00 Financial
Rambus Delivers Industry-Leading Client Chipsets for Next-Generation AI PC Memory Modules 2025-05-14 04:47:00 Chip
Renesas Partners with Indian Government to Drive Innovation Through Startups and Industry-Academia Collaboration, Strengthening India’s Semiconductor Ecosystem 2025-05-13 15:43:00 Business
Alps Alpine Adopts Silvaco’s Jivaro Pro to Accelerate SPICE Post-Layout Simulation 2025-05-13 12:52:00 EDA