Turning Fixed Costs into Variable Costs: Foundries and Clouds
One trend that has been accelerating for a couple of decades is turning fixed costs into variable costs. Often this is what is behind outsourcing some capability. Sometimes it is driven purely by lower variable costs (let's hire a team in Shanghai) or core-competence considerations (we don't really need to run our own cafeteria). However, often it is driven by a desire to switch an inflexible fixed cost for a variable cost. The biggest of these trends in our industry is the foundry/fabless model. Instead of a semiconductor company building their own fab (fixed cost), they buy wafers from foundries (variable costs).
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related Blogs
- 3 steps to shrinking your code size, your costs, and your power consumption
- Another issue on design outsourcing: what about the other costs?
- Wafer Costs: Out of Control or Not?
- Why Verification IP Switching Costs Are a Myth
Latest Blogs
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms