TSMC Versus Intel: The Race to Semiconductors in 3D!
June 27, 2011
While Intel is doing victory laps in the race to a 3D transistor (FinFet) @ 22nm, TSMC is in production with 3D IC technology. A 3D IC is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The question is which 3D race is more important to the semiconductor industry today?
To read the full article, click here
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- NavIC LDPC Decoder
- Complex Digital Up Converter
- Bluetooth Low Energy 6.0 Digital IP
- Verification IP for Ultra Ethernet (UEC)
Related Blogs
- TSMC (Lincoln) vs Samsung (Clinton) vs Intel (Washington)
- Can Intel Beat TSMC?
- TSMC vs Intel vs Samsung FinFETs
- Intel vs. Intel
Latest Blogs
- Evolution of CXL PBR Switch in the CXL Fabric
- CNNs and Transformers: Decoding the Titans of AI
- How is RISC-V’s open and customizable design changing embedded systems?
- Imagination GPUs now support Vulkan 1.4 and Android 16
- From "What-If" to "What-Is": Cadence IP Validation for Silicon Platform Success