Samsung Foundry and Synopsys Accelerate Multi-Die System Design
Multi-die systems are making big inroads in the semiconductor world. With compute-intensive applications like AI, high-performance computing (HPC), and automotive demanding more bandwidth and performance, heterogeneously integrated dies provide a way to deliver on these needs. While the chip design steps may be similar to those of their monolithic system on chip (SoC) counterparts, multi-die systems bring new challenges that call for holistic new approaches and technologies.
To support its customers on their journeys, Samsung Foundry needed to solve key system implementation challenges for their multi-die system. The foundry found its answers working with Synopsys, which has pioneered a comprehensive and scalable solution for fast heterogeneous integration. Working together, the two companies have developed Samsung Foundry’s Multi-Die System Implementation Flow with Synopsys 3DIC Compiler, supporting Samsung process nodes and I-Cube™ and X-Cube™ technologies. Two test chips successfully validate the manufacturing technology and design methodology. Samsung Foundry discussed its journey at this year’s SNUG Silicon Valley 2023 conference. Read on for details.
To read the full article, click here
Related Semiconductor IP
- AXI Interconnect
- AP Memory UHS PSRAM Controller
- Winbond HyperRAM Controller
- RapidIO Verification IP (VIP)
- Bluetooth 5.3 Dual Mode PHY IP
Related Blogs
- Five Key Techniques to Accelerate Software Bring-Up for Multi-Die Systems
- How Collaboration Will Accelerate Adoption of Multi-Die Systems
- Ensuring the Health and Reliability of Multi-Die Systems
- Samsung Foundry Accelerates Billion-Gate Low-Power Signoff with Synopsys VC LP
Latest Blogs
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms
- ReRAM-Powered Edge AI: A Game-Changer for Energy Efficiency, Cost, and Security
- Ceva-XC21 and Ceva-XC23 DSPs: Advancing Wireless and Edge AI Processing
- Cadence Silicon Success of UCIe IP on Samsung Foundry’s 5nm Automotive Process
- Empowering your Embedded AI with 22FDX+