Intel Calls for 3D IC
March 5, 2015
Intel is right: heterogeneous integration enabled by 3D IC "increasingly important part of scaling."
At the recent ISSCC Intel presented the following slide. Quoting from Extremetech coverage: "At 10nm and below, the path forward will become increasingly murky. What Intel has proposed is essentially a shift towards other types of cost-saving technologies and process adoptions rather than relying on strict lithography improvement. Intel may be keeping its next-generation materials and lithography plans quiet, but the company does intend to push the envelope in other ways. 2.5D and 3D integration will be critical to the development of next-generation SoCs."
To read the full article, click here
Related Semiconductor IP
- HBM4 PHY IP
- 10-bit SAR ADC - XFAB XT018
- eFuse Controller IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
Related Blogs
- What's driving 3D IC design? Do 2D EDA tools need a total overhaul to support 3D design?
- Want a peek at a possible Qualcomm 3D IC roadmap?
- Can Intel Beat TSMC?
- Intel vs. Intel
Latest Blogs
- Epson Achieves 50% Energy Efficiency with QuickLogic eFPGA
- Industry’s First Verification IP for Arm AMBA DTI-H
- 2025 Year in Review: Design Wins, Advanced Nodes, and Expanding Markets
- JESD204 Frame Mapping explained from converter samples to lanes
- Arm in the agentic era: Scaling the converged AI data center