What's driving 3D IC design? Do 2D EDA tools need a total overhaul to support 3D design?
April 14, 2011
The Electronic Design Process Symposium (EDPS) held last week in Monterey devoted most of Friday to a discussion of 3D design. I’ll be devoting several EDA360 Insider blog entries to this important topic. Today’s entry summarizes the presentation by Rahul Deokar, a Product Marketing Director at Cadence. Among other things, Deokar is responsible for 3D IC design tools.
Here’s what Deokar discussed in his presentation:
Related Semiconductor IP
- Temperature Glitch Detector
- Clock Attack Monitor
- SoC Security Platform / Hardware Root of Trust
- SPI to AHB-Lite Bridge
- Octal SPI Master/Slave Controller
Related Blogs
- 3D chips: design tools
- ICCAD Keynote: Design of Secure Systems - Where are the EDA Tools?
- Which Direction for EDA - 2D, 3D, or 360?
- 3D chips: IBM server