Arteris Selected by 2V Systems for IO Chiplet for Data Center
CAMPBELL, Calif. – October 21, 2025 – Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP for accelerating semiconductor creation in the AI era, today announced that 2V Systems has licensed Arteris’ Ncore 3 cache coherent interconnect IP and Arteris’ FlexNoC 5 non-coherent interconnect IP for its server IO chiplet, to serve as the connectivity hub for multi-die high-performance, cost-effective RISC-V-based SoCs for data centers and cloud infrastructure for AI workloads.
“The next generation of cutting-edge SoCs for AI and data centers will be built using IO chiplets to effectively scale compute,” said Aglaia Kong, CEO of 2V Systems. “Our multi-die SoCs will use Arteris Ncore IP and FlexNoC IP as the compute data transport across chiplets, meeting the high bandwidth, low latency, and low power needs of data centers and cloud infrastructure.”
The Arteris highly flexible and silicon-proven network-on-chip (NoC) interconnect IPs are ideal for serving as the data highway in the IO chiplet, meeting the energy and performance requirements for AI workloads and interoperability for integration into various multi-die SoCs.
“2V Systems is deploying Arteris technology to provide central communication across multi-die SoCs via the high-performance IO chiplet for various data center workloads and low latency chiplet compute integration,” said K. Charles Janac, president and CEO of Arteris. “Based on our multi-die solution, 2V Systems’ IO chiplet will serve to effectively integrate heterogeneous chiplets into SoCs that address the needs of AI data centers.”
Advanced semiconductor capabilities are vital for the development of future AI solutions and Arteris’ innovative technology plays a pivotal role. The Arteris multi-die solution allows customers to reduce cost and risk, compress development cycles, scale modular architectures, and deliver differentiated AI performance—while staying aligned with evolving industry realities. Learn more at arteris.com/multi-die.
About Arteris
Arteris is a global leader in system IP used in semiconductors to accelerate the creation of high-performance, power-efficient silicon. Arteris network-on-chip (NoC) interconnect IP and system-on-chip (SoC) integration automation software are used by the world’s top semiconductor and technology companies to improve overall performance, engineering productivity, reduce risk, lower costs, and bring complex designs to market faster. Learn more at arteris.com.
About 2V Systems
2V Systems is a Singapore-based semiconductor company focused on designing and developing high-performance, cost-effective RISC-V-based SoCs for data centers and cloud infrastructure, seamlessly integrated with artificial intelligence. The company boasts strong R&D capabilities, with a core technical team comprising experts with over 20 years of ASIC industry experience at leading companies such as Intel, AMD, and Google. Learn more at 2vsystems.com.
Related Semiconductor IP
- Smart Network-on-Chip (NoC) IP
- FlexNoC 5 Interconnect IP
- FlexNoC Functional Safety (FuSa) Option helps meet up to ISO 26262 ASIL B and D requirements against random hardware faults.
- NoC System IP
- Non-Coherent Network-on-Chip (NOC)
Related News
- Arteris Ncore Cache Coherent Interconnect IP Certified for ISO 26262 Automotive Functional Safety Standard
- Silicon-Proven Arteris IP Ncore Cache Coherent Interconnect Implemented in Toshiba ISO 26262-Compliant ADAS Chip
- Arteris IP Ncore Cache Coherent Interconnect Licensed by Bitmain for Sophon TPU Artificial Intelligence (AI) Chips
- Arteris Expands Ncore Cache Coherent Interconnect IP To Accelerate Leading-Edge Electronics Designs
Latest News
- Sofics Tapes Out Test Chip on TSMC 4nm Process with Novel ESD IP and Low-Power 1.8V and 3.3V GPIO Solutions
- ChipAgents Raises Oversubscribed $21M Series A to Redefine AI for Chip Design
- Zero ASIC announces release of Platypus heterogeneous eFPGA
- Arteris Selected by 2V Systems for IO Chiplet for Data Center
- Ceva Introduces Wi-Fi 7 1x1 Client IP to Power Smarter, More Responsive AI-Enabled IoT Devices and Emerging Physical AI Systems