GlobalFoundries Expands Partnership with Apple to Advance Wireless Connectivity and Power Management, Reinforcing U.S. Chip Manufacturing Leadership
2025-08-07 05:56:00
Foundries
Recent News
MIPI Alliance Releases I3C Basic v1.2 Utility and Control Bus Interface for Mobile, IoT and Data Center Applications
2025-08-06 13:40:00
Standard
GUC Monthly Sales Report – July 2025
2025-08-06 13:03:00
Financial
Ubitium and ADTechnology Collaborate to Bring Universal Processor to Market
2025-08-06 11:55:00
Business
Ceva's 20 Billion Device Milestone Paves the Way for a New Era in Smart Edge Innovation
2025-08-06 11:31:00
Business
Arteris Announces Financial Results for the Second Quarter and Estimated Third Quarter and Updated Full Year 2025 Guidance
2025-08-06 11:21:00
Financial
UMC Reports Sales for July 2025
2025-08-06 08:53:00
Financial
Mach42™ Unveils Breakthrough AI Solution for Analog Circuit Analysis
2025-08-06 07:08:00
EDA
NVM Express Publishes Set of NVMe Specifications, Enabling New Capabilities for AI, Cloud, Enterprise, and Client Storage
2025-08-06 06:10:00
Standard
PCI-SIG® Announces PCI Express® 8.0 Specification to Reach 256.0 GT/s
2025-08-06 05:58:00
Standard
BrainChip launches Akida Cloud for instant access to latest Akida neuromorphic technology
2025-08-05 18:00:00
Embedded Systems
Codasip looks to Silicon Creations’ PLL to drive RISC-V Automotive Safety-Critical Core
2025-08-05 15:22:00
Deals
UCIe Consortium Introduces 3.0 Specification With 64 GT/s Performance and Enhanced Manageability
2025-08-05 13:46:00
Standard
China Unyielding Ascent in RISC-V
2025-08-05 12:30:00
Commentary / Analysis
NEO Semiconductor Introduces World’s First Extreme High Bandwidth Memory (X-HBM) Architecture for AI Chips
2025-08-05 11:56:00
IP
Secure Your IC Design Project Slot with CoreHW for Q4 2025 & 2026
2025-08-05 11:39:00
Other
Edgewater Wireless Initiates Prototyping of AI Subsystem Powered by Arm Technology
2025-08-05 11:08:00
Embedded Systems
Re-Architecting the GPU Stack: From Atoms to Agents™
2025-08-05 10:21:00
IP
Everspin Appoints Sean Dougherty Vice President of Sales
2025-08-05 08:10:00
People
SEALSQ Receives Final Approval from the French Ministry of the Economy, Finance and Industrial and Digital Sovereignty and Completes Acquisition of IC’ALPS
2025-08-05 06:50:00
Business
MIPI Alliance Releases I3C Basic v1.2 Utility and Control Bus Interface for Mobile, IoT and Data Center Applications
2025-08-06 13:40:00
Standard
GUC Monthly Sales Report – July 2025
2025-08-06 13:03:00
Financial
Ubitium and ADTechnology Collaborate to Bring Universal Processor to Market
2025-08-06 11:55:00
Business
Ceva's 20 Billion Device Milestone Paves the Way for a New Era in Smart Edge Innovation
2025-08-06 11:31:00
Business
Arteris Announces Financial Results for the Second Quarter and Estimated Third Quarter and Updated Full Year 2025 Guidance
2025-08-06 11:21:00
Financial
UMC Reports Sales for July 2025
2025-08-06 08:53:00
Financial
Mach42™ Unveils Breakthrough AI Solution for Analog Circuit Analysis
2025-08-06 07:08:00
EDA
NVM Express Publishes Set of NVMe Specifications, Enabling New Capabilities for AI, Cloud, Enterprise, and Client Storage
2025-08-06 06:10:00
Standard
PCI-SIG® Announces PCI Express® 8.0 Specification to Reach 256.0 GT/s
2025-08-06 05:58:00
Standard
BrainChip launches Akida Cloud for instant access to latest Akida neuromorphic technology
2025-08-05 18:00:00
Embedded Systems
Codasip looks to Silicon Creations’ PLL to drive RISC-V Automotive Safety-Critical Core
2025-08-05 15:22:00
Deals
UCIe Consortium Introduces 3.0 Specification With 64 GT/s Performance and Enhanced Manageability
2025-08-05 13:46:00
Standard
China Unyielding Ascent in RISC-V
2025-08-05 12:30:00
Commentary / Analysis
NEO Semiconductor Introduces World’s First Extreme High Bandwidth Memory (X-HBM) Architecture for AI Chips
2025-08-05 11:56:00
IP
Secure Your IC Design Project Slot with CoreHW for Q4 2025 & 2026
2025-08-05 11:39:00
Other
Edgewater Wireless Initiates Prototyping of AI Subsystem Powered by Arm Technology
2025-08-05 11:08:00
Embedded Systems
Re-Architecting the GPU Stack: From Atoms to Agents™
2025-08-05 10:21:00
IP
Everspin Appoints Sean Dougherty Vice President of Sales
2025-08-05 08:10:00
People
SEALSQ Receives Final Approval from the French Ministry of the Economy, Finance and Industrial and Digital Sovereignty and Completes Acquisition of IC’ALPS
2025-08-05 06:50:00
Business