Quintauris Secures Capital Increase to Accelerate RISC-V Adoption 2026-02-24 14:55:00 Funding & Investments
MIPI Alliance Releases UniPro v3.0 and M-PHY v6.0, Accelerating JEDEC UFS Performance for Edge AI in Mobile, PC and Automotive 2026-02-24 14:26:00 Standards & Interconnects
Marvell to Showcase PCIe 8.0 SerDes Demonstration at DesignCon 2026 2026-02-24 14:19:58 IP Cores & Design
Embedded FPGA reaches a new stage of industrial maturity – Menta at Embedded World 2026 2026-02-24 12:45:24 Misc
Fraunhofer IPMS collaborates with Korean TSN Lab to further develop IP solutions for automotive and industrial connectivity 2026-02-24 07:05:00 IP Cores & Design
Via Licensing Alliance Announces Longcheer and Desay SV as New Licensees to its Qi Wireless Power Patent Pool 2026-02-24 06:55:00 Legal & IP Strategy
ASICLAND Signs New Contract with Global Neuromorphic AI Leader BrainChip 2026-02-24 06:41:00 Commercial Deals
Axelera AI Secures More Than $250 Million Funding on Global Commercial Growth 2026-02-24 06:35:00 Financials
Chips&Media Accelerates WAVE-N Ecosystem: Redefining the Future of Next-Generation Customized NPUs 2026-02-24 06:21:26 IP Cores & Design
proteanTecs and Gubo Technologies Collaborate to Deliver Unified Analytics Solution for Advanced Semiconductor Systems 2026-02-23 16:10:00 Commercial Deals
Cadence Completes Acquisition of Hexagon’s Design and Engineering Business, Advancing Leadership in Physical AI and Multiphysics 2026-02-23 14:44:00 Commercial Deals
TES Launches its µEngine: Parallel CPU System for Deterministic Real-Time HDL Applications 2026-02-23 13:27:00 IP Cores & Design
sensiBel Licenses Sofics’ Advanced ESD Solutions for their Studio-quality MEMS Microphone Technology 2026-02-23 09:28:20 Commercial Deals
Socionext and Innatera Introduce Integrated 60 GHz FMCW Radar and Neuromorphic Edge AI for Human Presence Detection 2026-02-23 09:20:40 Commercial Deals
MIPI Specifications for Embedded Audio, Ambient AI, Smart Camera, IoT and Medical to be Featured at 2026 embedded world Exhibition & Conference 2026-02-23 07:12:01 Standards & Interconnects
M31 Validates MIPI M-PHY v5.0 IP on 4nm, Advances 3nm Development to Enable UFS 4.1 Applications 2026-02-23 06:30:00 IP Cores & Design
ASICLAND Partners with Daegu Metropolitan City to Advance Demonstration and Commercialization of Korean AI Semiconductors 2026-02-20 06:39:22 Commercial Deals
SEALSQ and Lattice Collaborate to Deliver Unified TPM-FPGA Architecture for Post-Quantum Security 2026-02-19 07:09:00 Commercial Deals
SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion 2026-02-19 06:32:03 Commercial Deals