CEO interview: S3 Semi ready for custom opportunity
2017-10-17 13:38:00
Commentary / Analysis
Recent News
Intel to Battle in FPGA-as-a-Service Race
2017-10-17 13:23:00
Commentary / Analysis
CEVA and LG Electronics Partner for Smart 3D Camera Solution
2017-10-17 13:14:00
Deals
Montage Technology Licenses Allegro DVT's Latest Multi-Format Video Encoder IP for Next Generation Set-Top Box Chips
2017-10-17 13:08:00
Deals
REFLEX CES Partners with NOLAM EMBEDDED SYTEMS to Provide Integrated CANbus IP Core Solutions on FPGA COTS Boards
2017-10-17 09:42:00
Embedded Systems
CAST Introduces GZIP Accelerator Through New Intel FPGA Data Center Acceleration Ecosystem
2017-10-17 08:21:00
Embedded Systems
NovaSparks introduces "U.S. Equities in a Box" solution
2017-10-17 08:19:00
Embedded Systems
Wafer Shipments Forecast to Increase in 2017, 2018 and 2019
2017-10-17 08:08:00
Commentary / Analysis
Microsemi's Lowest Power, Cost-Optimized Mid-Range PolarFire FPGAs Achieve Key Milestone by Passing PCI SIG's PCIe Endpoint Compliance Suites
2017-10-17 06:13:00
FPGA
Gartner Says Worldwide Device Shipments Will Increase 2.0 Percent in 2018, Reaching Highest Year-Over-Year Growth Since 2015
2017-10-17 06:05:00
Commentary / Analysis
MIPI Alliance Announces Milestones in Membership Growth and Industry Influence
2017-10-17 01:43:00
Other
Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 ARM TechCon in Santa Clara
2017-10-16 16:35:00
Other
Accellera Systems Initiative advances the SystemC ecosystem with a new core language library
2017-10-16 15:54:00
EDA
Dolphin Integration Joins GlobalFoundries FDXcelerator Program to Provide Breakthrough Fabric IP
2017-10-16 14:57:00
Business
SiFive Joins TSMC IP Alliance Program
2017-10-16 14:23:00
Other
Thalia DA attracts fresh investment as semiconductor industry recognizes analog IP reuse challenge
2017-10-16 13:51:00
Business
Open-Silicon to Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing and Networking Applications and Showcase its IoT Gateway SoC Reference Design for Smart City Applications at ARM TechCon 2017
2017-10-16 13:41:00
Other
TSMC Senior Vice President Dr. Stephen Tso to Retire
2017-10-16 13:28:00
People
Dr. Haijun Zhao, Dr. Liang Mong Song Appointed as SMIC Co-CEO and Executive Director
2017-10-16 11:49:00
People
Codasip Hires IP Industry Veteran Chris Jones as Vice President of Marketing
2017-10-16 09:02:00
People
Intel to Battle in FPGA-as-a-Service Race
2017-10-17 13:23:00
Commentary / Analysis
CEVA and LG Electronics Partner for Smart 3D Camera Solution
2017-10-17 13:14:00
Deals
Montage Technology Licenses Allegro DVT's Latest Multi-Format Video Encoder IP for Next Generation Set-Top Box Chips
2017-10-17 13:08:00
Deals
REFLEX CES Partners with NOLAM EMBEDDED SYTEMS to Provide Integrated CANbus IP Core Solutions on FPGA COTS Boards
2017-10-17 09:42:00
Embedded Systems
CAST Introduces GZIP Accelerator Through New Intel FPGA Data Center Acceleration Ecosystem
2017-10-17 08:21:00
Embedded Systems
NovaSparks introduces "U.S. Equities in a Box" solution
2017-10-17 08:19:00
Embedded Systems
Wafer Shipments Forecast to Increase in 2017, 2018 and 2019
2017-10-17 08:08:00
Commentary / Analysis
Microsemi's Lowest Power, Cost-Optimized Mid-Range PolarFire FPGAs Achieve Key Milestone by Passing PCI SIG's PCIe Endpoint Compliance Suites
2017-10-17 06:13:00
FPGA
Gartner Says Worldwide Device Shipments Will Increase 2.0 Percent in 2018, Reaching Highest Year-Over-Year Growth Since 2015
2017-10-17 06:05:00
Commentary / Analysis
MIPI Alliance Announces Milestones in Membership Growth and Industry Influence
2017-10-17 01:43:00
Other
Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 ARM TechCon in Santa Clara
2017-10-16 16:35:00
Other
Accellera Systems Initiative advances the SystemC ecosystem with a new core language library
2017-10-16 15:54:00
EDA
Dolphin Integration Joins GlobalFoundries FDXcelerator Program to Provide Breakthrough Fabric IP
2017-10-16 14:57:00
Business
SiFive Joins TSMC IP Alliance Program
2017-10-16 14:23:00
Other
Thalia DA attracts fresh investment as semiconductor industry recognizes analog IP reuse challenge
2017-10-16 13:51:00
Business
Open-Silicon to Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing and Networking Applications and Showcase its IoT Gateway SoC Reference Design for Smart City Applications at ARM TechCon 2017
2017-10-16 13:41:00
Other
TSMC Senior Vice President Dr. Stephen Tso to Retire
2017-10-16 13:28:00
People
Dr. Haijun Zhao, Dr. Liang Mong Song Appointed as SMIC Co-CEO and Executive Director
2017-10-16 11:49:00
People
Codasip Hires IP Industry Veteran Chris Jones as Vice President of Marketing
2017-10-16 09:02:00
People