Cadence Announces Digital and Signoff Flow Support for Body-Bias Interpolation for GLOBALFOUNDRIES 22FDX Process Technology 2017-10-13 05:50:00 EDA
Rambus Delivers High-Speed SerDes Interface Solutions on GLOBALFOUNDRIES FX-14 ASIC Platform for Data Center and Enterprise 2017-10-12 15:14:00 IP
Imec and Analog Devices sign strategic research partnership for development of next-generation IoT devices 2017-10-12 13:16:00 Business
Hiroshima University Research Team Accelerates the Development of a Computer-Aided Medical Diagnosis System with Cadence Tensilica Vision P6 DSP Core and Protium S1 FPGA-Based Prototyping Platform 2017-10-12 13:12:00 Deals
S3 Semiconductors selected to advance Satellite Transceiver Technology in ESA ARTES Partner Programme 2017-10-12 12:42:00 Business
Gartner Says Worldwide Semiconductor Revenue to Reach $411 Billion in 2017 2017-10-12 10:36:00 Commentary / Analysis
New MIPI Alliance Group Collaborates with Automotive Industry Experts to Address Interface Specifications for Automotive Applications 2017-10-12 03:40:00 Other
GLOBALFOUNDRIES Introduces New Automotive Platform to Fuel Tomorrow's Connected Car 2017-10-12 03:18:00 Foundries
QuickLogic Partners with AcconSys to Expand eFPGA Design Activity in China 2017-10-11 13:10:00 Business
Cadence Achieves TUV SUD's First Comprehensive "Fit for Purpose - TCL1" Certification in Support of Automotive ISO 26262 Standard 2017-10-11 13:04:00 EDA
Mobiveil Announces 25xN RapidIO Specification 4.1 (25G) Digital Controller IP for Next-Generation Wireless Networking, High-Performance Computing Applications 2017-10-11 08:42:00 IP
NAGASE Partners with Accelize Extending FPGA Acceleration-as-a-Service to Complex Data Analytics 2017-10-10 17:19:00 Embedded Systems
Sandia National Laboratories Licenses Flex Logix's Embedded FPGA IP For Multiple Products 2017-10-10 14:47:00 Deals