TSMC Shareholders Approve NT$8 Cash Dividend and Elect Board of Directors; Board of Directors Elect Mark Liu as Chairman and C.C. Wei as CEO and Vice Chairman
Hsinchu, Taiwan, R.O.C. – June 5, 2017 –TSMC (NYSE: TSM) today held its 2018 Annual Shareholders’ Meeting, which passed the following major resolutions:
1. Acknowledged the 2017 Business Report and Financial Statements. Consolidated revenue totaled NT$977.45 billion and net income was NT$343.11 billion, with diluted earnings per share of NT$13.23.
2. Approved the distribution of a NT$8 cash dividend per common share.
3. Approved amendments to TSMC’s Articles of Incorporation.
4. Elected TSMC’s 14th Board of Directors. The nine Directors are: Mark Liu, Mei-ling Chen (Representative of the Development Fund, Executive Yuan), C.C. Wei, F.C. Tseng, Sir Peter L. Bonfield, Stan Shih, Kok-Choo Chen, Michael R. Splinter, and Thomas J. Engibous. Five of those elected, Sir Peter L. Bonfield, Stan Shih, Kok-Choo Chen, Michael R. Splinter, and Thomas J. Engibous, are independent directors.
TSMC also held the first meeting of the 14th Board of Directors, and in the first day of the meeting the Board elected Dr. Mark Liu as Chairman and Dr. C.C. Wei as Chief Executive Officer (CEO) and Vice Chairman. The meeting will continue for a second day on June 6.
Related Semiconductor IP
- TSMC CLN3FFP HBM4 PHY
- Wi-Fi 7(be) RF Transceiver IP in TSMC 22nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- HBM3 PHY V2 (Hard) - TSMC N3P
- USB4 Gen3 x2-lane PHY, TSMC N5, 1.2V, N/S orientation, type-C
Related News
- TSMC Shareholders Elect Board of Directors; Board of Directors Unanimously Re-elects Dr. Mark Liu as Chairman and Dr. C.C. Wei as CEO and Vice Chairman
- TSMC Dr. Morris Chang Announces Retirement in June 2018. Future Dual Leadership Will Be Mark Liu as Chairman And C.C. Wei as CEO.
- SMIC Transitions CEO Responsibility to Dr. Haijun Zhao While Dr. Tzu-Yin Chiu Stays as Vice Chairman and Non-Executive Director
- Global Unichip announced the retirement of Vice Chairman and CEO K.C. Shih
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack