OIF Demonstrates Industry-Wide Interoperability at Scale at OFC 2026, Advancing Energy Efficiency, Performance and Capacity for AI-Era Data Center Networks
Live multi-vendor interoperability demo features 40 member companies and highlights 800ZR, 400ZR, Multi-span Optics, CEI-448G, CEI-224G, Co-Packaging, CMIS, EEI and more
Fremont, Calif. — January 28, 2026 — OIF, where the optical networking industry’s interoperability work gets done, will present a live, multi-vendor interoperability demonstration at OFC 2026 in Los Angeles. Featuring 40 member companies, the showcase highlights how OIF-driven interoperable networking solutions enable scalable, energy-efficient networks for AI-era data center environments.
OFC 2026 will take place March 15–19, 2026, at the Los Angeles Convention Center, with the exhibition running March 17–19.
Located in booth #2017, OIF’s demo will highlight real-world interoperability across key technologies including 800ZR, 400ZR, Multi-span Optics, Common Electrical I/O (CEI) CEI-448G, CEI-224G, Common Management Interface Specification (CMIS), Co-Packaging, Energy Efficient Interfaces (EEI) and more. This work underscores the industry’s need for deployable, multi-vendor building blocks across optical, electrical, energy-efficient and management interfaces that deliver higher performance, improved efficiency and scalable capacity in disaggregated architectures.
Participating companies are 3M, Accelight, Adtek, Adtran, Alphawave Semi, Amphenol Communications Solutions, Anritsu Corporation, AOI, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., Eoptolink Technology, EXFO, Furukawa Electric, HGGenuine, HPE, Keysight Technologies, Lessengers, Ligent, Inc., Luxshare-Tech, Marvell, MaxLinear Inc., Molex, MultiLane, Nokia, O-Net, Samtec, Semtech, SENKO Advanced Components, Silith, Sumitomo Electric Industries, Synopsys, Inc., TE Connectivity, Terahop PTE Ltd., US Conec, VeEX Inc., Wilder Technologies and Xscape Photonics.
“AI-era infrastructure demands more than speed — it demands interoperability you can trust, plus the energy efficiency required to scale responsibly,” said Mike Klempa, OIF Secretary/Treasurer and Physical and Link Layer (PLL) Interoperability Working Group Chair (Alphawave Semi). “At OFC 2026, OIF and our members will show how the industry is translating specifications into real interoperability across coherent optics, high-speed electrical interfaces, energy-efficient architectures and common management so networks can move from innovation to deployment with confidence.”
OIF’s work is grounded in generating specifications that become the foundation for interoperability. Its Implementation Agreements (IAs) close the gap between standards and interoperable products, systems and networks. By convening the entire ecosystem — component suppliers, system vendors, hyperscalers and network operators — OIF accelerates alignment on practical, interoperable interfaces that enable open, scalable networking.
Visit OIF at booth #2017 at OFC 2026 to see interoperability in action, or learn more about the demo here.
About OIF
OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 170+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world.
Related Semiconductor IP
- eUSB2V2.0 Controller + PHY IP
- I/O Library with LVDS in SkyWater 90nm
- 50G PON LDPC Encoder/Decoder
- UALink Controller
- RISC-V Debug & Trace IP
Related News
- Vitesse and Xilinx Demonstrate OIF Interoperability Enabling 10Gbps Ethernet at OFC 2003
- OIF Members Demonstrate How Interoperability Accelerates Solutions for Today's and Future Global Networks at OFC 2022
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
- Marvell Demonstrates Industry’s First End-to-end PCIe Gen 6 Over Optics for Accelerated Infrastructure at OFC 2025
Latest News
- Telechips and DivX Renew IC Technology Licensing Agreement
- OIF Demonstrates Industry-Wide Interoperability at Scale at OFC 2026, Advancing Energy Efficiency, Performance and Capacity for AI-Era Data Center Networks
- Eliyan Secures $50 Million in Strategic Investments from Leading Hyperscalers and AI Infrastructure Providers to Accelerate Scalable AI Systems
- FuriosaAI ships RNGD, data-center-ready AI inference GPU alternative
- AMD, Adeas, Nextera Video, and intoPIX Announce Cost-Optimized IPMX Solution for AV-over-IP at ISE 2026