RAM IP for TSMC
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86
RAM IP
for TSMC
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Ultra Low Power Embedded SRAM - TSMC 22ULL
- Single port, single voltage rail synchronous SRAM
- Hierarchical Bit Line – subdividing the array into columns/ rows, banks and local blocks.
- Configurable mux factor sets column length and overall aspect ratio
- Bit Line Voltage control eliminates potential low operating voltages issues
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Ultra Low Voltage Embedded SRAM - TSMC 22ULL
- Single port, single voltage rail synchronous SRAM
- Hierarchical Bit Line Architecture – sub-diving the array into columns/rows, banks and local blocks
- ‘Smart Assist’ – controls voltage drive to selected bit cells and bit lines in read and write cycles
- Pre-charge mux sense – read circuit that helps reduce both active and leakage power in the memory array
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Ultra Low Power Embedded SRAM - TSMC 28HPC+
- Single port, single voltage rail synchronous SRAM
- Hierarchical Bit Line – subdividing the array into columns/ rows, banks and local blocks.
- Configurable mux factor sets column length and overall aspect ratio
- Bit Line Voltage control eliminates potential low operating voltages issues
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Ultra Low Voltage Embedded SRAM - TSMC 28HPC+
- Single port, single voltage rail synchronous SRAM
- Hierarchical Bit Line Architecture – sub-diving the array into columns/rows, banks and local blocks
- ‘Smart Assist’ – controls voltage drive to selected bit cells and bit lines in read and write cycles
- Pre-charge mux sense – read circuit that helps reduce both active and leakage power in the memory array
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Ultra Low Voltage Embedded SRAM - TSMC 40ULP
- Single port, single voltage rail synchronous SRAM
- Hierarchical Bit Line Architecture – sub-diving the array into columns/rows, banks and local blocks
- ‘Smart Assist’ – controls voltage drive to selected bit cells and bit lines in read and write cycles
- Pre-charge mux sense – read circuit that helps reduce both active and leakage power in the memory array
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High-Density eMRAM Compiler TSMC 22ULL
- eMRAM compiler enabling low-power designs requiring high memory capacity
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TSMC CLN5FF High Density Single Port SRAM Compiler
- The High Density Single Port SRAM operates within voltage range from 0.675 V to 0.825 V and junction temperature range from -40 °C to 125 °C. The available supported macro size is configurable from 512 bits to 576K bits. The Compiler is divided into 1 groups according to their column selection numbers (Mux=8).
- ? Pins and metal layers
- – 1P3M (1X_h_1Xb_v): 3 metal layers used and top metal is MXb.
- – Power mesh supported with M3 pins
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TSMC 0.15umLV Single-Port/Dual-Port SRAM, Single-Port/Two-Port Register File and Diffusion ROM Compiler
- High Density
- High Speed
- Size Sensitive Self-Time Delay for Fast Access
- Automatic Power Down
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Low power, high speed, and high density configurable Double Density SRAM
- Based on patent-pending 1T cell design
- Implemented with unmodified standard CMOS logic process
- Best-in-class active power, leakage current, density, and speed
- Supports large instances (e.g. 32Mbit)