Need really big FPGAs? Xilinx will be taking the "3D" route for initial Virtex 7 parts
Ivo Bolsens, the Xilinx CTO and Senior VP, presented a keynote at the 8th International SoC Conference a couple of weeks ago and one of the aspects of FPGA development that he discussed was Xilinx’ plan for creating large-capacity Virtex 7 FPGAs using 28nm process technology. Every leading-edge process technology experiences a learning curve and initially, it’s hard to make the largest possible chips in any new process technology with commercially viable yields. So Xilinx faced a problem: it would not be able to make the largest possible Virtex 7 FPGAs for a while using 28nm technology. What to do for those leading-edge customers who always want to use the largest, fastest parts as soon as possible?
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related Blogs
- Is the Buzz around Xilinx's 2.5D FPGA Justified?
- PLD Overview: Xilinx and Altera
- Xilinx ARMs FPGAs, Altera to MIPSify Them
- Intel Eyeing Xilinx?
Latest Blogs
- lowRISC Tackles Post-Quantum Cryptography Challenges through Research Collaborations
- How to Solve the Size, Weight, Power and Cooling Challenge in Radar & Radio Frequency Modulation Classification
- Programmable Hardware Delivers 10,000X Improvement in Verification Speed over Software for Forward Error Correction
- The Integrated Design Challenge: Developing Chip, Software, and System in Unison
- Introducing Mi-V RV32 v4.0 Soft Processor: Enhanced RISC-V Power