Unleashing Innovation and Energy Efficiency at TSMC Events
In the world of technology, innovation is the driving force that propels companies to the forefront of their respective market segments. For Credo, the mission to innovate means we focus on remaining at the forefront of delivering industry leading high-speed, energy efficient interconnect solutions for every wired connection in the data infrastructure market.
In 2023 Credo is participating in numerous events hosted by the Taiwan Semiconductor Manufacturing Company (TSMC), including the most recent TSMC Technology Symposiums in San Jose, Austin, Israel, and Shanghai. Attending these Tech Symposiums gives our team new insight into developing in new process technologies, including the latest in 2nm and 3nm processes. Working closely with an undisputed leader like TSMC as an OIP ecosystem partner is what allows Credo to continue to deliver groundbreaking advancements in high-performance connectivity with the most competitive energy efficiency.
“As a part of the TSMC ecosystem, Credo will enable other companies developing complex SoCs to take advantage of our unique high-performance, low-power architectures to develop solutions for next-generation switching, artificial intelligence (AI), machine learning (ML) and high-performance computing applications,” explains Joe Sheredy, Vice President of Systems Engineering at Credo. “These types of collaborative efforts empower innovation throughout the supply chain and shorten design time, time-to-volume, time-to-market, and ultimately, time-to-revenue.”
For the past eight years, Credo has been attending the Technology Symposium events where the TSMC ecosystem transforms ideas into world-changing solutions. This year, Credo is taking part in five Technology Symposiums, to showcase the following technologies:
To read the full article, click here
Related Semiconductor IP
- 64G SerDes
- 112G SerDes USR & XSR
- Extended Long-Reach (XLR) Multi Standard SerDes (MSS) IP
- 4.25 Gbps Multi-Standard SerDes
- 1-56Gbps Serdes - 7nm (Multi-reference Clock)
Related Blogs
- Unleashing Gaming and AI Innovation Across Consumer Device Markets with New Arm GPUs
- ReRAM-Powered Edge AI: A Game-Changer for Energy Efficiency, Cost, and Security
- Automotive Ethernet Interest Soars at Industry Events
- Altera Back to TSMC at 10nm? Xilinx Staying There
Latest Blogs
- Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
- The Role of GPU in AI: Tech Impact & Imagination Technologies
- Time-of-Flight Decoding with Tensilica Vision DSPs - AI's Role in ToF Decoding
- Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles
- Deep Robotics and Arm Power the Future of Autonomous Mobility