Key Considerations for Addressing Multi-Die System Verification Challenges
Multi-die systems are quickly becoming the architecture of choice for hyperscalers, developers of automated vehicles, and mobile designers. As a single package with heterogeneous dies, or chiplets, these systems are providing an avenue for lower power and increased performance for compute-intensive applications in an era when the gains due to Moore’s law are slowing down.
While developing multi-die systems can follow similar verification processes as monolithic SoCs, every step must be considered from a single die to a system perspective. Does this mean that verifying multi-die systems is harder? There are unique challenges, to be sure, but with the right framework, flow, and technologies, these challenges can be overcome.
Read on to learn what you need to know about multi-die system verification. You can also gain additional insights by watching our on-demand, six-part webinar series, “Requirements for Multi-Die System Success.” The series covers multi-die system trends and challenges, early architecture design, co-design and system analysis, die-to-die connectivity, verification, and system health.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related Blogs
- Industry Leaders Discuss "Overcoming the Challenges of Multi-die Systems Verification"
- Industry Leaders Discuss "Overcoming the Challenges of Multi-die Systems Verification"
- NAND Flash Memory - Key Element For Your Multi-Die Systems Verification - Part 1
- Can the Semiconductor Industry Overcome Thermal Design Challenges in Multi-Die Systems?
Latest Blogs
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms