Industry Leaders Discuss "Overcoming the Challenges of Multi-die Systems Verification"
Lauro Rizzatti, hardware-assisted verification consultant, served as moderator for a well-attended and lively 2024 DVCon U.S. panel discussion on the challenges in multi-die systems verification.
The hour-long session featured panelists Alex Starr, AMD Corporate Fellow; Bharat Vinta, Director of HW Engineering at Nvidia; Divyang Agrawal, Sr. Director of RISC-V Cores at Tenstorrent; and Arturo Salz, Synopsys Fellow.
What follows is a shortened panel transcript, edited for readability.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- 1G BASE-T Ethernet Verification IP
- Network-on-Chip (NoC)
- Microsecond Channel (MSC/MSC-Plus) Controller
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
Related Blogs
- Industry Leaders Discuss "Overcoming the Challenges of Multi-die Systems Verification"
- Overcoming USB Type-C Verification Challenges
- NAND Flash Memory - Key Element For Your Multi-Die Systems Verification - Part 1
- Can the Semiconductor Industry Overcome Thermal Design Challenges in Multi-Die Systems?
Latest Blogs
- Rivian’s autonomy breakthrough built with Arm: the compute foundation for the rise of physical AI
- AV1 Image File Format Specification Gets an Upgrade with AVIF v1.2.0
- Industry’s First End-to-End eUSB2V2 Demo for Edge AI and AI PCs at CES
- Integrating Post-Quantum Cryptography (PQC) on Arty-Z7
- UA Link PCS customizations from 800GBASE-R Ethernet PCS Clause 172