Can "Less than Moore" FDSOI provides better ROI for Mobile IC?
In this previous article, I was suggesting that certain chip makers may take a serious look at a disruptive way to look at Moore’s law, as they may get better ROI, profit and even better revenue. The idea is to select technology node and packaging technique in order to optimize the Price, Performance, Power triptych and manage chip development lead time to optimize Time To Market (TTM) and cost. Only a complete business plan would confirm the validity of this assumption, but we think it could be a new direction to be explored, so we propose some tracks.
The goal for a chip maker supporting “Less Than Moore” is not to displace the Qualcomm or Samsung, following Moore’s law and getting back more than enough revenue to invest and develop IC ever more integrated, targeting smaller technology node, supporting the type of Roadmap you can see below. This roadmap from Samsung shows Discrete Application Processor and Baseband Processor paths, as well as in parallel a roadmap for cost sensitive systems with Integrated (Application + BB) processor.
To read the full article, click here
Related Semiconductor IP
- SoC Security Platform / Hardware Root of Trust
- SPI to AHB-Lite Bridge
- Octal SPI Master/Slave Controller
- I2C and SPI Master/Slave Controller
- AHB/AXI4-Lite to AXI4-Stream Bridge
Related Blogs
- Could "Less than Moore" be better to support Mobile segment explosion?
- How to manage decreasing by 70% a $5B IC business in less than 6 years? TI knows the answer...
- Doing Moore with Less
- Processor Wars: NVIDIA reveals a phantom fifth ARM Cortex-A9 processor core in Kal-El mobile processor IC. Guess why it's there?