Intel Has No Process Advantage In Mobile, says ARM CEO
Intel has no advantage in IC manufacturing when it comes to manufacturing processes used for mobile ICs, Warren East, CEO of ARM, tells EW.
"This time last year there was a lot of noise from the Intel camp about their manufacturing superiority," says East, "we're sceptical about this because, while the ARM ecosystem was shipping on 28nm, Intel was shipping on 32nm. So I don't see where they're ahead."
To read the full article, click here
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
- MIPI SoundWire I3S Peripheral IP
- ML-DSA Digital Signature Engine
- P1619 / 802.1ae (MACSec) GCM/XTS/CBC-AES Core
Related Blogs
- How audio development platforms can take advantage of accelerated ML processing
- TSMC (Lincoln) vs Samsung (Clinton) vs Intel (Washington)
- ARM's New CEO Relishes Intel Competition.
- Yes, Intel 14nm Really is Delayed...And They Lost $600M on Mobile
Latest Blogs
- Why What Where DIFI and the new version 1.3
- ML-DSA explained: Quantum-Safe digital Signatures for secure embedded Systems
- Efficiency Defines The Future Of Data Movement
- Why Standard-Cell Architecture Matters for Adaptable ASIC Designs
- ML-KEM explained: Quantum-safe Key Exchange for secure embedded Hardware