Intel's Master-Plan
July 13, 2012
You can see why Intel decided to accept ASML's offer to invest in it -because the difference between the plans of Intel and TSMC on when to start 450mm production, and the plans of ASML on when to produce a 450mm lithographic machine is comical.
TSMC says it intends to start trial production on 450mm wafers in 2013-14 and to be in volume production in 2015-16.
Intel says it will be getting first generation 450mm tools in 2015 and will start making ICs on it. In 2016/2017 second generation 2 tools will be delivering real productivity and Intel will then start upgrading its existing fabs."
To read the full article, click here
Related Semiconductor IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- Parameterizable compact BCH codec
- 1G BASE-T Ethernet Verification IP
- Network-on-Chip (NoC)
- Microsecond Channel (MSC/MSC-Plus) Controller
Related Blogs
- TSMC Could Make Half Of Intel's Atom Output
- Intel’s Atom-based Tunnel Creek SOC with integrated PCIe interface opens new era for embedded developers
- McAfee is Intel’s Foot in the Door
- Intel's McAfee buy: Too few answers to too many questions, for now!
Latest Blogs
- Physical AI at the Edge: A New Chapter in Device Intelligence
- Rivian’s autonomy breakthrough built with Arm: the compute foundation for the rise of physical AI
- AV1 Image File Format Specification Gets an Upgrade with AVIF v1.2.0
- Industry’s First End-to-End eUSB2V2 Demo for Edge AI and AI PCs at CES
- Integrating Post-Quantum Cryptography (PQC) on Arty-Z7