TSMC Could Make Half Of Intel's Atom Output
September 28, 2009
TSMC is to start cranking out Atoms in Q4, according to DigiTimes, and is expected to reach 6k wafers a month by the end of the year and 35k wpm next year.
The chips will be made on a 40nm process at TSMC's Tainan fab in the south of Taiwan.
To read the full article, click here
Related Semiconductor IP
- Bluetooth Low Energy 6.0 Digital IP
- Ultra-low power high dynamic range image sensor
- Flash Memory LDPC Decoder IP Core
- SLM Signal Integrity Monitor
- Embedded USB2 (eUSB) Controller + PHY IP
Related Blogs
- TSMC (Lincoln) vs Samsung (Clinton) vs Intel (Washington)
- Altera, Intel, TSMC, ARM: the Plot Thickens
- Can Intel Beat TSMC?
- Is Altera Leaving Intel for TSMC?
Latest Blogs
- SiFive Celebrates 10 Years as Your Trusted Partner for RISC-V IP Innovation
- MIPI: Powering the Future of Connected Devices
- ESD Protection for an High Voltage Tolerant Driver Circuit in 4nm FinFET Technology
- Designing the AI Factories: Unlocking Innovation with Intelligent IP
- Smarter SoC Design for Agile Teams and Tight Deadlines