TSMC Could Make Half Of Intel's Atom Output
TSMC is to start cranking out Atoms in Q4, according to DigiTimes, and is expected to reach 6k wafers a month by the end of the year and 35k wpm next year.
The chips will be made on a 40nm process at TSMC's Tainan fab in the south of Taiwan.
To read the full article, click here
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related Blogs
- Altera, Intel, TSMC, ARM: the Plot Thickens
- Can Intel Beat TSMC?
- Is Altera Leaving Intel for TSMC?
- TSMC vs Intel vs Samsung FinFETs
Latest Blogs
- Cadence Announces Industry's First Verification IP for Embedded USB2v2 (eUSB2v2)
- The Industry’s First USB4 Device IP Certification Will Speed Innovation and Edge AI Enablement
- Understanding Extended Metadata in CXL 3.1: What It Means for Your Systems
- 2025 Outlook with Mahesh Tirupattur of Analog Bits
- eUSB2 Version 2 with 4.8Gbps and the Use Cases: A Comprehensive Overview