How Collaboration Will Accelerate Adoption of Multi-Die Systems
Welcome to the wonderfully complex and rich world of multi-die systems. Breaking free from the monolithic SoC mold, multi-die systems integrate heterogeneous dies into a single package. This relatively new architecture is steadily transforming the semiconductor industry by allowing chip designers to reach new heights of functionality with higher compute power and the ability to reuse proven dies, enabling more powerful systems in phones, computers, and even self-driving cars. However, with rapid advancement comes challenges, many of which were discussed at last month’s Accelerating Mainstream Adoption of Multi-Die Systems panel discussion, hosted by Synopsys.
This virtual event brought together Murat Becer, vice president of research and development at Ansys, Inc.; Michael Schaffert, senior vice president at Bosch; Cheolmin Park, corporate vice president at Samsung; Lalitha Immaneni, vice president of architecture, design, and technology solutions at Intel; and Shekhar Kapoor, senior director of product line management at Synopsys. The panel was moderated by Marco Chiapetta, co-founder and principal analyst at HotTech Vision and Analysis, and touched on the current state of multi-die system design, its applications, and the industry’s expectations for multi-die system adoption.
Read on for highlights from the panel and insights into why industry leaders believe collaboration is critical to accelerating the adoption of multi-die systems.
To read the full article, click here
Related Semiconductor IP
- Specialized Video Processing NPU IP for SR, NR, Demosaic, AI ISP, Object Detection, Semantic Segmentation
- Ultra-Low-Power Temperature/Voltage Monitor
- Multi-channel Ultra Ethernet TSS Transform Engine
- Configurable CPU tailored precisely to your needs
- Ultra high-performance low-power ADC
Related Blogs
- How Multi-Die Systems Create New Business Opportunities for Semiconductor Companies
- Five Key Techniques to Accelerate Software Bring-Up for Multi-Die Systems
- How Photonics Can Light the Way for Higher Performing Multi-Die Systems
- Industry Leaders Discuss "Overcoming the Challenges of Multi-die Systems Verification"
Latest Blogs
- Silicon Insurance: Why eFPGA is Cheaper Than a Respin
- One Bit Error is Not Like Another: Understanding Failure Mechanisms in NVM
- Introducing CoreCollective for the next era of open collaboration for the Arm software ecosystem
- Integrating eFPGA for Hybrid Signal Processing Architectures
- eUSB2V2: Trends and Innovations Shaping the Future of Embedded Connectivity