Android Audio Offload Explained at Mobile World Congress
Want to lower power in your next AndroidTM device? Look to the industry's first Android-compatible technology for a licensed audio DSP. The Tensilica® HiFi Audio Tunneling for Android takes full advantage of the enhancements in the recent KitKat release to prolong battery life, cutting audio processing power by up to 14X, which results in double the smartphone playback time.
How does this cut the power? By completely offloading the audio from the host applications processor. Until now, Android devices have had to run audio on the host processor or on an OEM proprietary offload framework that still required the encoded and decoded audio streams to be managed by the host CPU.
Watch the video from Mobile World Congress. Yipeng Liu, Cadence Senior Engineering Manager, talks about power-efficient Android offloading and shows our demo.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related Blogs
- Android, meet fridge. Fridge, Android
- TSMC 40nm Yield Explained!
- The silicon behind Android
- TSMC Open Innovation Platform Explained
Latest Blogs
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms