Android Audio Offload Explained at Mobile World Congress
Want to lower power in your next AndroidTM device? Look to the industry's first Android-compatible technology for a licensed audio DSP. The Tensilica® HiFi Audio Tunneling for Android takes full advantage of the enhancements in the recent KitKat release to prolong battery life, cutting audio processing power by up to 14X, which results in double the smartphone playback time.
How does this cut the power? By completely offloading the audio from the host applications processor. Until now, Android devices have had to run audio on the host processor or on an OEM proprietary offload framework that still required the encoded and decoded audio streams to be managed by the host CPU.
Watch the video from Mobile World Congress. Yipeng Liu, Cadence Senior Engineering Manager, talks about power-efficient Android offloading and shows our demo.
To read the full article, click here
Related Semiconductor IP
- ISO/IEC 7816 Verification IP
- 50MHz to 800MHz Integer-N RC Phase-Locked Loop on SMIC 55nm LL
- Simulation VIP for AMBA CHI-C2C
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- USB 20Gbps Device Controller
Related Blogs
- TSMC 40nm Yield Explained!
- The silicon behind Android
- TSMC Open Innovation Platform Explained
- Android Outsells iPhones, Opens Processor Market
Latest Blogs
- A Comparison on Different AMBA 5 CHI Verification IPs
- Cadence Recognized as TSMC OIP Partner of the Year at 2025 OIP Ecosystem Forum
- Accelerating Development Cycles and Scalable, High-Performance On-Device AI with New Arm Lumex CSS Platform
- Desktop-Quality Ray-Traced Gaming and Intelligent AI Performance on Mobile with New Arm Mali G1-Ultra GPU
- Powering Scale Up and Scale Out with 224G SerDes for UALink and Ultra Ethernet