TSMC Open Innovation Platform Explained
November 2, 2009
Launched in April 2008, the TSMC Open Innovation Platform initiative is a collaborative strategy aimed at breaking the bottlenecks of semiconductor design enablement in order to promote growth for the industry as a whole.
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related Blogs
- TSMC Extends Open Innovation Platform
- TSMC OIP: What to Do With 20,000 Wafers Per Day
- TSMC OIP and the Insatiable Computing Trend!
- TSMC OIP: Process Status
Latest Blogs
- A Bench-to-In-Field Telemetry Platform for Datacenter Power Management
- IDS-Verify™: From Specification to Sign-Off – Automated CSR, Hardware Software Interface and CPU-Peripheral Interface Verification
- RISC-V and GPU Synergy in Practice: A Path Towards High-Performance SoCs from SpacemiT K3
- EDA AI Agents: Intelligent Automation in Semiconductor & PCB Design
- Why Security Can't Exist Without Trust