TSMC Open Innovation Platform Explained
November 2, 2009
Launched in April 2008, the TSMC Open Innovation Platform initiative is a collaborative strategy aimed at breaking the bottlenecks of semiconductor design enablement in order to promote growth for the industry as a whole.
Related Semiconductor IP
- HBM4 PHY IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- VIP for Compute Express Link (CXL)
- HBM4 Controller IP
Related Blogs
- TSMC Extends Open Innovation Platform
- TSMC OIP: What to Do With 20,000 Wafers Per Day
- TSMC OIP and the Insatiable Computing Trend!
- TSMC OIP: Process Status