TSMC Open Innovation Platform Explained
November 2, 2009
Launched in April 2008, the TSMC Open Innovation Platform initiative is a collaborative strategy aimed at breaking the bottlenecks of semiconductor design enablement in order to promote growth for the industry as a whole.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related Blogs
- TSMC Extends Open Innovation Platform
- TSMC OIP: What to Do With 20,000 Wafers Per Day
- TSMC OIP and the Insatiable Computing Trend!
- TSMC OIP: Process Status
Latest Blogs
- lowRISC Tackles Post-Quantum Cryptography Challenges through Research Collaborations
- How to Solve the Size, Weight, Power and Cooling Challenge in Radar & Radio Frequency Modulation Classification
- Programmable Hardware Delivers 10,000X Improvement in Verification Speed over Software for Forward Error Correction
- The Integrated Design Challenge: Developing Chip, Software, and System in Unison
- Introducing Mi-V RV32 v4.0 Soft Processor: Enhanced RISC-V Power