A Primer on Multi-Die Systems
The mighty silicon chip is being asked to do more and more these days. It’s not surprising, given that our electronic devices are being infused with greater intelligence and connectivity. For many demanding applications—such as AI, hyperscale data centers, and autonomous vehicles—monolithic SoCs are no longer enough. This is driving demand for multi-die systems, in which multiple dies, or chiplets, are integrated into a single package.
Multi-die systems are massive and complex, to be sure, but they are also providing an answer to the slowing of Moore’s law, addressing the challenges of systemic complexity. Given all their interdependencies, these systems must be developed from concept to production holistically to achieve optimal power, performance, and area (PPA). While the steps to reach tapeout are similar to those for their monolithic counterparts, the process must be approached from a comprehensive system perspective.
How can you be sure your multi-die system will perform as intended? And do so efficiently? From design exploration through in-field monitoring, what are the key steps in between that you should consider from a system standpoint?
To read the full article, click here
Related Semiconductor IP
- xSPI Multiple Bus Memory Controller
- MIPI CSI-2 IP
- PCIe Gen 7 Verification IP
- WIFI 2.4G/5G Low Power Wakeup Radio IP
- Radar IP
Related Blogs
- New Synopsys Report Highlights Key Industry Insights on the Impact of Multi-Die Systems
- What Are Digital Twins? A Primer on Virtual Models
- PCIe 4.0: A Quick Primer on New Features
- A Focus on Mission-Critical Defense Solutions at GOMACTech
Latest Blogs
- The Growing Importance of PVT Monitoring for Silicon Lifecycle Management
- Unlock early software development for custom RISC-V designs with faster simulation
- HBM4 Boosts Memory Performance for AI Training
- Using AI to Accelerate Chip Design: Dynamic, Adaptive Flows
- Locking When Emulating Xtensa LX Multi-Core on a Xilinx FPGA