TSMC's Chip Scaling Efforts Reach Crossroads at 2nm
By Alan Patterson, EETimes (June 7, 2021)
Perpetuating Moore’s Law — the observation that the transistor density in a typical chip doubles every two years — poses a number of challenges at the 3nm node, yet Taiwan Semiconductor Manufacturing Corp. (TSMC) remains optimistic.
There are many predictions Moore’s Law is likely to hit a wall soon, but “how soon?” is open to debate. Also, there are technologies that promise ongoing increases in performance that are not dependent on doubling transistor density. The timing of all that will have far-reaching implications. At last week’s TSMC 2021 Technology Symposium, TSMC CEO C. C. Wei gave the example of data centers, which consume over one percent of global electricity generated.
“Estimates suggest global electricity usage from data centers is projected to grow from five to forty times between 2010 to 2030. Why do projections vary so widely?” Wei asked. “Divergent estimates are partly due to the difficulty of making an accurate projection of our footprint. There are too many variables to consider, including whether Moore’s Law can continue.”
To read the full article, click here
Related Semiconductor IP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
Related News
- MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency
- Alchip Announces Successful 2nm Test Chip Tapeout
- M31 Unveils Full Range of Automotive IP Solutions at ICCAD Illuminating the Future of Automotive Chip Development
- OpenAI Reportedly to Finalize In-House AI Chip Design Soon, Set for TSMC’s 3nm Production
Latest News
- Movellus Partners with Synopsys to Deliver Power Efficiency for Next Generation IC’s
- BrainChip Enables the Next Generation of Always-On Wearables with the AkidaTag© Reference Platform
- eSOL and Quintauris Partner to Expand Software Integration in RISC-V Automotive Platforms
- PQShield unveils ultra-small PQC embedded security breakthroughs
- CAST Introduces 400 Gbps UDP/IP Hardware Stack IP Core for High-Performance ASIC Designs