Intel, TSMC to detail 2nm processes at IEDM
By Peter Clarke, eeNews Europe (October 8, 2024)
Intel’s attempts to get back to the leading-edge in chipmaking and foundry TSMC’s steps defining that leading-edge will be on show at this year’s International Electron Devices Meeting (IEDM) coming up in December, in San Francisco.
In a late news paper, researchers from TSMC will unveil the N2 manufacturing process, which is a nominal 2nm process designed for computing in AI, mobile and high-performance computing. In the following paper in the same session Intel engineers will provide details of scaling RibbonFETs, the name Intel gives to its nanosheet transistors.
To read the full article, click here
Related Semiconductor IP
- Xtal Oscillator on TSMC CLN7FF
- Wide Range Programmable Integer PLL on UMC L65LL
- Wide Range Programmable Integer PLL on UMC L130EHS
- Wide Range Programmable Integer PLL on TSMC CLN90G-GT-LP
- Wide Range Programmable Integer PLL on TSMC CLN80GC
Related News
- Siemens announces certifications for TSMC's latest processes, celebrates recent achievements for Siemens and TSMC collaboration
- TSMC allocates $6bn for 2nm capacity in Taiwan
- Synopsys and TSMC Collaborate to Accelerate 2nm Innovation for Advanced SoC Design with Certified Digital and Analog Design Flows
- Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes
Latest News
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- The world’s first open source security chip hits production with Google
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing