Toshiba, Fujitsu to develop SoCs, but 'may' merge units
Toshiba, Fujitsu to develop SoCs, but 'may' merge units to speed up designs
By Semiconductor Business News
June 19, 2002 (10:41 a.m. EST)
URL: http://www.eetimes.com/story/OEG20020619S0021
TOKYO -- In another major partnership in Japan's IC industry, Fujitsu Ltd. and Toshiba Corp. today announced plans to explore a comprehensive collaboration focusing on system-on-a-chip (SoC) products, including the possibility of “integrating” their respective operations. Aiming to provide SoC chip solutions at the 100-nm (0.10-micron) node and below, Fujitsu and Toshiba will establish several joint working groups to investigate the development of chip standards, processor cores, and advanced ICs for communications and other fields. Through these collaborations, Fujitsu and Toshiba aim to further strengthen their respective semiconductor businesses and create a competitive model that combines their complementary capabilities. As the collaboration progresses on the SoC front, Fujitsu and Toshiba also said that they “may seek” ways to expand the scope of their partnership, including the possibility of “integrating” their operations. No other details were given about these plans, however. Fujitsu and Toshiba are no strangers to each other. The companies are already collaborating in the semiconductor field, including their joint development of FCRAMs for networking applications.
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- Bluetooth Low Energy 6.0 Digital IP
- Verification IP for Ultra Ethernet (UEC)
- MIPI SWI3S Manager Core IP
- Ultra-low power high dynamic range image sensor
Related News
- Heard on the Beat: AMD-ST to merge memory units?
- Apple, Huawei Use TSMC, But Their 7nm SoCs Are Different
- NEC merges process, SoC units
- Palm to base next-generation wireless units on TI platform
Latest News
- Arm Neural Technology Delivers Smarter, Sharper, More Efficient Mobile Graphics for Developers
- Indian Startup Builds Full-Stack Edge AI Chips Using In-House IP
- AIStorm & Tower Semiconductor Introduce Cheetah HS, World’s First Up-to-260K FPS AI-in-Imager Chip for Inspection, Robotics & Sports
- EnSilica Establishes New EU Mixed-Signal Design Centre in Budapest, Hungary
- M31 Technology: Robust Foundry Demand, Operating Margin Expected to Recover in 2026