Apple, Huawei Use TSMC, But Their 7nm SoCs Are Different
By Illumi Huang, EETimes (January 22, 2020)
Most SoCs in 2019 use 7nm process technologies. But at a closer look, everyone’s 7nm – used in smartphone SoCs or even PC CPUs – seems somewhat different.
When talking about the most advanced semiconductor manufacturing processes, it seems that most of the SoCs in 2019 can be collectively classified as 7nm. But not all 7nm is equal. We summarize some of the more popular SoCs today. The process used by these SoCs is as follows:
To read the full article, click here
Related Semiconductor IP
- TSMC CLN3FFP HBM4 PHY
- Wi-Fi 7(be) RF Transceiver IP in TSMC 22nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- HBM3 PHY V2 (Hard) - TSMC N3P
- USB4 Gen3 x2-lane PHY, TSMC N5, 1.2V, N/S orientation, type-C
Related News
- Gartner Says Huawei Secured No. 2 Worldwide Smartphone Vendor Spot, Surpassing Apple in Second Quarter 2018
- Huawei Launches Kirin 980, the World's First Commercial 7nm SoC
- Apple Describes 7nm iPhone SoC
- Huawei planning on using SMIC to fab 7nm ICs this year
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack